In addition to the popular SnPb, SAC, and high-Pb alloys, numerous alternative alloys are designed to meet the special requirements of the semiconductor industry. Liao’s presentation included a discussion on the use of these materials for step soldering, thick gold finish soldering, low-temperature soldering, and more. He also outlined how specialty alloys can be used as advanced thermal interface materials to fulfill high-end thermal management demands.
Liao provides technical support for Indium Corporation’s electronics assembly materials, semiconductor and advanced assembly materials, and engineered solders and thermal management materials. He has more than ten years of experience in surface mount technology, specializing in defect prevention, quality continuous improvement, and cost reduction. Liao earned a bachelor’s degree from Tianjin University in Mechanical and Electronics Engineering.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
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