Sbiroli will present Impact of Storage Conditions on the Integrity of a No-Clean Solder Paste. As solder paste is being engineered to endure longer storage periods, it is important to keep this material in the best possible condition before and during use. Sbiroli will discuss the results of a study designed to determine a superior storage process and eliminate potential flux separation by examining four storage conditions and two package orientations over the course of a year for certain variables.
Sbiroli is responsible for the coordination, business maintenance, and deployment of technical services and resources to Indium Corporation’s multinational and regional accounts in Midwest USA. He joined Indium Corporation in 1993 and has over 25 years of experience in the electronics industry. He achieved one of the highest scores on the SMTA Process Engineer certification exam, and is certified as an IPC Specialist for IPC-A-600 and IPC-A-610D. Sbiroli actively participates in the development of industry standards with the IPC and received the IPC’s Distinguished Committee Service award for his work on the J-STD-004B (Requirements for Soldering Fluxes) standards. He earned his bachelor’s degree in Mechanical Engineering Technology from the State University of New York Institute of Technology.
To view papers authored by Sbiroli and other Indium Corporation experts, visit www.indium.com/techlibrary.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
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