Indium Corporation will feature its proven solder paste for Heterogeneous Integration & Assembly (HIA) and system-in-package (SiP) applications at Advanced System in Package (SiP) Technology Conference & Exhibition, June 25-27 in Monterey, California.

Indium Corporation’s Indium3.2HF Solder Paste meets current and evolving challenges encountered in fine-pitch Heterogeneous Integration and SiP applications. Indium3.2HF delivers:

  • Consistent printing performance
  • Long stencil life
  • Outstanding slump resistance
  • Excellent wetting ability
  • Superior fine-pitch soldering ability 
  • Water solubility 

Indium Corporation’s soldering materials for HIA and SiP applications have a proven track record of success in more than 2 billon front-end module SiP devices manufactured in the last three years using the company’s materials. 

See Indium Corporation’s experts at the show or visit the company’s HIA page at www.indium.com/HIA to learn more.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.