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올바른 열 인터페이스를 사용하지 않으면 번인 및 테스트 과정에서 화상을 입기 쉽습니다.

이 게시물은 높은 신뢰성과 낮은 보이드 발생을 위한 강화 솔더 프리폼에 대해 설명하는 시리즈 중 마지막 게시물입니다. 이 게시물에서는 DOE의 결과에 초점을 맞춰 다음과 같이 알아볼 것입니다.

Probe testability is the last of the IPC tests. This test measures the nature of the flux residue to determine whether it interferes with the post-soldering electronic probe testing of the circuit

이 블로그 게시물은 고신뢰성 및 저비용을 위한 강화 솔더 프리폼에 대해 설명하는 블로그 게시물 시리즈 중 네 번째입니다.

Surface Insulation Resistance (SIR) tests measure the post soldering effect on the electrical integrity of the circuit boards. Fluxes should facilitate soldering, but not degrade the circuit by

This is the third in a series of blog posts that talk about reinforced Solder Preforms for high–reliability and low voiding. This post will focus on how InFORMS® affect bondline consistency

Let’s look in on Patty, it’s been awhile. Patty was looking forward to sleeping in. Normally she was up very early, sometimes before 5:30AM, after usually getting to bed too late, so she

Gold tin eutectic solder (AuSn20, or 80%gold, 20%tin by weight) isused in a varietyof applications requiring ahigh reliability, high melting solder joint. This includes die-attach and even lid-attach

이 블로그 게시물은 고신뢰성 및 낮은 보이드 발생을 위한 강화 솔더 프리폼에 대해 설명하는 시리즈 블로그 게시물 중 두 번째입니다. 이 게시물에서는 InFORMS®의 기술 발전에 초점을 맞출 것입니다.

“구리 거울 시험”이라고도 불리는 이 부식 시험은, 리플로우 전 플럭스의 부식성을 정성적으로 평가한다는 점에서 구리 쿠폰 시험과는 달리

The copper coupon is a pretty simple test. A given amount of solder is reflowed onto a copper coupon with a specified amount of each flux. The test can be performed on either lead-free solder or

Remember back when I said that our Project 99super heroes “aren’t just for fun – they really work?” As I shared, their characteristics have been identified using a battery of

Icicles appear as stalactites hanging on the bottom of the circuit board during SMT wave

Most materials become brittle at very low temperatures, pure indium does not. It performs consistently at room and at extremely low temperatures. This property is why engineers across the world use

The Alchemist (WF-9955) applies her sophisticated understanding of wave soldering flux ingredients and their interactions with metallizations to defeat Oxide, while at the same time effectively

Electro-migration is another common challenge encountered in wave soldering and can be cause by a number of factors: Chloride or other ionic residue on the bare board and/or components Hygroscopic

Indium gaskets? You have probably heard of automotive head gaskets and plumbing gaskets and even gaskets used in sailing (that was a new one to me!). Buthave youheard of indium metal gaskets? The

Folks, If you think about it, to evaluate any process you typically want to know its precision and accuracy. Look at the dart players in the Figure 1 below. The yellow player has good precision, but

Now that we’ve met our Project 99 heroes, it is important to understand their counterparts…the common villains that can wreak havoc during your wave soldering process. Today, I’d

Created in the Indium Corporation R&D labs, four exciting wave soldering fluxes – known as Project 99 – are ready to solve your challenges and save the world! Project 99 is a fun way

인디엄 코퍼레이션은 인듐 도금 양극과 인듐 설파메이트 도금 용액을 모두 공급합니다. 이러한 제품은 기성 도금 장비와 함께 사용하거나 직접 제작하여 사용할 수 있습니다. (Eric