博客

档案

Career Day

Today was a different kind of experience as an intern at Indium Corporation. Yesterday, I was told that Jim McCoy and I would be visiting Remsen Elementary School’s career

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Intermetallic Growth Rate is Strongly Temperature Dependent

Folks, In our last post, I discussed that, contrary to popular belief, intermetallic compounds (IMCs) formed in soldering processes are not necessarily brittle. I reviewed some literature that

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Braze: Advantages of Indium-Contained Alloys

Indium is commonly used to suppress the melting point of various alloys. These low-temp indium alloys range in solidus temperature from 157°C to 7°C. That’s right; some of the alloys

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EGaIn (Eutectic Gallium / Indium Liquid Metal) Will Change How We Think Of Electronics

Recently we discussed stretchable electronics developments happening at Carnegie Mellon University. I hope you found that story interesting, if you did then you are sure to enjoy the work that is

档案

Intermetallics and Kirkendall Voids Continue to Grow at Room Temperature

Folks, In my last post, I discussed intermetallic compounds (IMCs) and what I referred to as the “miracle of

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量子点 多功能性。

在之前的博客中,我简要介绍了什么是量子点

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Early Experimentation Soldering Metals and Non-Metals With Indium

Throughout the Indium Corporation website, and most prolifically on the Indium Blog, we have discussed soldering to non-metals. There really is no perfect list of all the materials that indium can

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Using C Charts for Different Sized Data Sets

Folks, C Charts are control charts used to track attribute data. As an example, suppose you are tracking defects at the end of an SMT assembly process. Management hasstated that they want to know how

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Specifying Cryogenic Seals

In a recent post we interviewed Shamaine Engler on the topic of cryogenic seal applications. As a follow-up, today we are speaking with Kim Flanagan (Technical Support Engineer) about specifying

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Solder Paste Storage & Handling: Best Practices

Phil Zarrow: Brook, we've been talking about process issues with solder paste. Let's talk about care and handling. We receive our solder paste from shipping and handling, what's next?

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Create Healthier & Stronger…Solder Joints

This is the time of year when people begin to look back on their New Year’s resolutions and realize that their good intentions were just that. While some people will just give up – smart

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Gold-Based Solder Wire for High-Reliability Applications

80Au20Sn solder wire is widely used in the aerospace and medical electronics fields. The wire is used in hand soldering, or automated processes, for soldering wires to contacts. The alloy's high

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Gallium III Chloride

Chlorides -common anduseful … like salt, NaCl. Consider one ofthe more unusual and reactive salts: Gallium Trichloride GaCl3: an anhydrous solid at room temperature melts at

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Cold Welding: Use This Unique Indium Property to Your Advantage

Indium metal will ‘adhere’ to itself at room temperature. Many materials will cold weld with enough force, but indium is unique in that it can bond to itself with very little

实习

非一般实习

College intern season is here! In the coming days Indium Corporation will begin advertising job postings for our highly competitive 2017 Summer College Internship program. This year wewill

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用于预烧的高性能金属热界面选项

It is easy to get burned during the burn-in and test process if you don't use the right thermal interface

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Reinforced Solder Preforms for High-Reliability and Low Voiding | Voiding Results

This is the last in a series of posts that discusses reinforced Solder Preforms for high–reliability and low voiding. This post will focus on the results of our DOE to find out if we did, in

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Project 99波峰焊助焊剂 验证:探针可测试性

Probe testability is the last of the IPC tests. This test measures the nature of the flux residue to determine whether it interferes with the post-soldering electronic probe testing of the circuit

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增强型焊片 高可靠性 低空洞率 空洞率

This is the fourth in a series of blog posts that talks about reinforced Solder Preforms for high–reliability and low

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Project 99 Wave Solder Flux Performance Proof: SIR Testing

Surface Insulation Resistance (SIR) tests measure the post soldering effect on the electrical integrity of the circuit boards. Fluxes should facilitate soldering, but not degrade the circuit by

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Reinforced Solder Preforms for High-Reliability and Low Voiding | Quantifiable Bondline Consistency

This is the third in a series of blog posts that talk about reinforced Solder Preforms for high–reliability and low voiding. This post will focus on how InFORMS® affect bondline consistency

在Indium,我们致力于研究、开发和制造先进的电子组装材料 以应对当今、未来以及更长远的挑战。