部落格

Today was a different kind of experience as an intern at Indium Corporation. Yesterday, I was told that Jim McCoy and I would be visiting Remsen Elementary School’s career

Folks, In our last post, I discussed that, contrary to popular belief, intermetallic compounds (IMCs) formed in soldering processes are not necessarily brittle. I reviewed some literature that

Indium is commonly used to suppress the melting point of various alloys. These low-temp indium alloys range in solidus temperature from 157°C to 7°C. That’s right; some of the alloys

最近我們討論了卡內基梅隆大學在可伸縮電子領域的最新進展。希望您覺得這則報導很有趣；如果確實如此，那麼您一定會喜歡這項研究——

Folks, In my last post, I discussed intermetallic compounds (IMCs) and what I referred to as the “miracle of

在之前的部落格文章中，曾簡要介紹了什麼是量子點

Throughout the Indium Corporation website, and most prolifically on the Indium Blog, we have discussed soldering to non-metals. There really is no perfect list of all the materials that indium can

Folks, C Charts are control charts used to track attribute data. As an example, suppose you are tracking defects at the end of an SMT assembly process. Management hasstated that they want to know how

在最近的一篇文章中，我們就低溫密封應用的主題訪問了 Shamaine Engler。作為後續報導，今天我們將與 Kim Flanagan（技術支援工程師）討論有關指定

Phil Zarrow: Brook, we've been talking about process issues with solder paste. Let's talk about care and handling. We receive our solder paste from shipping and handling, what's next?

This is the time of year when people begin to look back on their New Year’s resolutions and realize that their good intentions were just that. While some people will just give up – smart

80Au20Sn 焊錫線廣泛應用於航太及醫療電子領域。這種焊錫線可用於手工焊接或自動化製程，將導線焊接到觸點上。合金的高

氯化物 - 常見且有用的......如鹽，NaCl。考慮一種較不尋常和反應性較強的鹽：三氯化鎵GaCl3：室溫下為無水固體，熔點為

Indium metal will ‘adhere’ to itself at room temperature. Many materials will cold weld with enough force, but indium is unique in that it can bond to itself with very little

College intern season is here! In the coming days Indium Corporation will begin advertising job postings for our highly competitive 2017 Summer College Internship program. This year wewill

在燒機和測試過程中，如果不使用正確的熱介質，很容易被燒壞。

這是本系列文章的最後一篇，討論高可靠性和低空洞的強化焊料預型件。這篇文章將集中討論我們的 DOE 結果，以找出我們是否在以下方面做到了

Probe testability is the last of the IPC tests. This test measures the nature of the flux residue to determine whether it interferes with the post-soldering electronic probe testing of the circuit

這是博文系列的第四篇，談到高可靠性和低成本的強化焊料預型件。

Surface Insulation Resistance (SIR) tests measure the post soldering effect on the electrical integrity of the circuit boards. Fluxes should facilitate soldering, but not degrade the circuit by

This is the third in a series of blog posts that talk about reinforced Solder Preforms for high–reliability and low voiding. This post will focus on how InFORMS® affect bondline consistency