部落格

在燒機和測試過程中，如果不使用正確的熱介質，很容易被燒壞。

這是本系列文章的最後一篇，討論高可靠性和低空洞的強化焊料預型件。這篇文章將集中討論我們的 DOE 結果，以找出我們是否在以下方面做到了

Probe testability is the last of the IPC tests. This test measures the nature of the flux residue to determine whether it interferes with the post-soldering electronic probe testing of the circuit

這是博文系列的第四篇，談到高可靠性和低成本的強化焊料預型件。

Surface Insulation Resistance (SIR) tests measure the post soldering effect on the electrical integrity of the circuit boards. Fluxes should facilitate soldering, but not degrade the circuit by

This is the third in a series of blog posts that talk about reinforced Solder Preforms for high–reliability and low voiding. This post will focus on how InFORMS® affect bondline consistency

Let’s look in on Patty, it’s been awhile. Patty was looking forward to sleeping in. Normally she was up very early, sometimes before 5:30AM, after usually getting to bed too late, so she

Gold tin eutectic solder (AuSn20, or 80%gold, 20%tin by weight) isused in a varietyof applications requiring ahigh reliability, high melting solder joint. This includes die-attach and even lid-attach

這是博文系列的第二篇，談論高可靠性和低空洞的強化焊料預型件。本篇文章將集中介紹 InFORMS® 的技術進展。

The corrosion test, also called the “copper mirror test,” differs from the copper coupon test because it qualitatively determines the corrosivity of the flux before reflow rather than

The copper coupon is a pretty simple test. A given amount of solder is reflowed onto a copper coupon with a specified amount of each flux. The test can be performed on either lead-free solder or

Remember back when I said that our Project 99super heroes “aren’t just for fun – they really work?” As I shared, their characteristics have been identified using a battery of

Icicles appear as stalactites hanging on the bottom of the circuit board during SMT wave

Most materials become brittle at very low temperatures, pure indium does not. It performs consistently at room and at extremely low temperatures. This property is why engineers across the world use

The Alchemist (WF-9955) applies her sophisticated understanding of wave soldering flux ingredients and their interactions with metallizations to defeat Oxide, while at the same time effectively

Electro-migration is another common challenge encountered in wave soldering and can be cause by a number of factors: Chloride or other ionic residue on the bare board and/or components Hygroscopic

Indium gaskets? You have probably heard of automotive head gaskets and plumbing gaskets and even gaskets used in sailing (that was a new one to me!). Buthave youheard of indium metal gaskets? The

Folks, If you think about it, to evaluate any process you typically want to know its precision and accuracy. Look at the dart players in the Figure 1 below. The yellow player has good precision, but

Now that we’ve met our Project 99 heroes, it is important to understand their counterparts…the common villains that can wreak havoc during your wave soldering process. Today, I’d

Created in the Indium Corporation R&D labs, four exciting wave soldering fluxes – known as Project 99 – are ready to solve your challenges and save the world! Project 99 is a fun way

Indium Corporation 提供鍍铟陽極和硫酸銨鍍槽溶液。這些產品可與現成的電鍍設備搭配使用，或用於自製設備。(艾瑞克