Indium Corporation Junior Application Engineer Siegfried Lorenz will present at the 2023 LED Meets SMT forum on October 25 in Leinfelden-Echterdingen. The forum, featuring innovative presentations by partners from across the industry, focuses on the processing of LEDs in electronics manufacturing.
In his presentation, titled LED Soldering Low Void & Temp, Lorenz examines contemporary LED matrix systems utilized in modern applications which necessitate the use of lower soldering temperatures to mitigate potential warping effects. Furthermore, the incorporation of drop shock resistant connections, characterized by minimal voids, significantly enhances the capacity for efficient heat dissipation, thereby bolstering overall system performance.
“In addition to mitigating warping effects, lower soldering temperatures also result in a reduced C02 footprint within the application,” said Lorenz. “With the EU’s ambitious goal of reducing greenhouse gas emissions to at least 55% below 1990 levels by 2030, it is vital to adopt energy-saving processes to remain competitive in the years to come.”
Lorenz is responsible for providing application engineering support for Indium Corporation’s customers throughout Germany, Austria, and Switzerland. He provides customers with engineering and specifications assistance. He also helps to accelerate the sales cycle by providing technical recommendations. Prior to joining Indium Corporation, Lorenz held positions as a senior mechanic, SMD operator, and head of SMD with major semiconductor manufacturers and electronic design firms. He holds a bachelor’s degree in electrical technology and management.
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