Indium Corporation Junior Application Engineer Siegfried Lorenz will present at the 2023 LED Meets SMT forum on October 25 in Leinfelden-Echterdingen. The forum, featuring innovative presentations by partners from across the industry, focuses on the processing of LEDs in electronics manufacturing.
In his presentation, titled LED Soldering Low Void & Temp, Lorenz examines contemporary LED matrix systems utilized in modern applications which necessitate the use of lower soldering temperatures to mitigate potential warping effects. Furthermore, the incorporation of drop shock resistant connections, characterized by minimal voids, significantly enhances the capacity for efficient heat dissipation, thereby bolstering overall system performance.
“In addition to mitigating warping effects, lower soldering temperatures also result in a reduced C02 footprint within the application,” said Lorenz. “With the EU’s ambitious goal of reducing greenhouse gas emissions to at least 55% below 1990 levels by 2030, it is vital to adopt energy-saving processes to remain competitive in the years to come.”
洛伦茨负责为德国、奥地利和瑞士各地的铟泰公司客户提供应用 工程支持。他为客户提供工程和规格方面的协助，并通过提供技术建议来帮助加快销售周期。在加入铟泰公司 之前，洛伦茨曾在多家大型半导体制造商和电子设计公司担任高级机械师、阻焊定义焊盘 操作员以及阻焊定义焊盘 负责人等职务。他拥有电气技术与管理专业的学士学位。
关于铟泰铟泰公司
铟泰公司 是面向全球电子、半导体、薄膜及热管理 顶级材料精炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；以及NanoFoil 。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
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