Indium Corporation Junior Application Engineer Siegfried Lorenz will present at the 2023 LED Meets SMT forum on October 25 in Leinfelden-Echterdingen. The forum, featuring innovative presentations by partners from across the industry, focuses on the processing of LEDs in electronics manufacturing.
In his presentation, titled LED Soldering Low Void & Temp, Lorenz examines contemporary LED matrix systems utilized in modern applications which necessitate the use of lower soldering temperatures to mitigate potential warping effects. Furthermore, the incorporation of drop shock resistant connections, characterized by minimal voids, significantly enhances the capacity for efficient heat dissipation, thereby bolstering overall system performance.
“In addition to mitigating warping effects, lower soldering temperatures also result in a reduced C02 footprint within the application,” said Lorenz. “With the EU’s ambitious goal of reducing greenhouse gas emissions to at least 55% below 1990 levels by 2030, it is vital to adopt energy-saving processes to remain competitive in the years to come.”
Lorenz 負責為 Indium Corporation 在德國、奧地利和瑞士的客戶提供應用工程支援。他為客戶提供工程和規格方面的協助。他也透過提供技術建議，協助加快銷售週期。在加入 Indium Corporation 之前，Lorenz 曾在主要半導體製造商和電子設計公司擔任高級技工、SMD 操作員和 SMD 主管等職務。他擁有電子技術與管理學士學位。
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以在www.linkedin.com/company/indium-corporation/ 追蹤我們的專家，From One Engineer To Another (#FOETA)。
