Indium Corporation's Brandon Judd, technical support engineer, presented at the Surface Mount Technology Association (SMTA) Intermountain chapter meeting on Feb. 12.
Judd's presentation, How Solder Preforms with Next-Generation Flux Coatings Can Reduce QFN Voiding, quantifies the solder preform requirements and process adjustments needed to reduce or eliminate voiding beneath QFN components. It also provides guidelines as to how to incorporate solder preforms into a standard SMT process and on the more demanding requirements for flux coatings on solder preforms.
Judd supports Indium Corporation's advanced SMT materials, including solder pastes, thermal interface materials, and engineered solders. He specializes in optimizing SMT lines, and has expertise in stencil printing parameters and reflow profiling. In addition to providing customer support, he performs testing on new products in Indium Corporation's Advanced Materials and Process Development Lab.
Judd has a bachelor's degree in mechanical engineering technology from the State University of New York Polytechnic Institute. He is an SMTA-certified process engineer and earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College. He is also a certified IPC-A-600 and 610D specialist.
The SMTA is an international network of professionals who build skills, share practical experience and develop solutions in electronics assembly technologies, including microsystems, emerging technologies, and related business operations.
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