Indium Corporation's Brandon Judd, technical support engineer, presented at the Surface Mount Technology Association (SMTA) Intermountain chapter meeting on Feb. 12.
Judd's presentation, How Solder Preforms with Next-Generation Flux Coatings Can Reduce QFN Voiding, quantifies the solder preform requirements and process adjustments needed to reduce or eliminate voiding beneath QFN components. It also provides guidelines as to how to incorporate solder preforms into a standard SMT process and on the more demanding requirements for flux coatings on solder preforms.
Judd supports Indium Corporation's advanced SMT materials, including solder pastes, thermal interface materials, and engineered solders. He specializes in optimizing SMT lines, and has expertise in stencil printing parameters and reflow profiling. In addition to providing customer support, he performs testing on new products in Indium Corporation's Advanced Materials and Process Development Lab.
Judd has a bachelor's degree in mechanical engineering technology from the State University of New York Polytechnic Institute. He is an SMTA-certified process engineer and earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College. He is also a certified IPC-A-600 and 610D specialist.
The SMTA is an international network of professionals who build skills, share practical experience and develop solutions in electronics assembly technologies, including microsystems, emerging technologies, and related business operations.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家 From One Engineer ToAnother®(#FOETA) 。
