Indium Corporation's Brandon Judd, technical support engineer, presented at the Surface Mount Technology Association (SMTA) Intermountain chapter meeting on Feb. 12.
Judd's presentation, How Solder Preforms with Next-Generation Flux Coatings Can Reduce QFN Voiding, quantifies the solder preform requirements and process adjustments needed to reduce or eliminate voiding beneath QFN components. It also provides guidelines as to how to incorporate solder preforms into a standard SMT process and on the more demanding requirements for flux coatings on solder preforms.
Judd supports Indium Corporation's advanced SMT materials, including solder pastes, thermal interface materials, and engineered solders. He specializes in optimizing SMT lines, and has expertise in stencil printing parameters and reflow profiling. In addition to providing customer support, he performs testing on new products in Indium Corporation's Advanced Materials and Process Development Lab.
Judd has a bachelor's degree in mechanical engineering technology from the State University of New York Polytechnic Institute. He is an SMTA-certified process engineer and earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College. He is also a certified IPC-A-600 and 610D specialist.
The SMTA is an international network of professionals who build skills, share practical experience and develop solutions in electronics assembly technologies, including microsystems, emerging technologies, and related business operations.
Indium Corporation 是全球电子、半导体、太阳能、薄膜和热管理市场的主要材料制造商和供应商。产品包括焊料和助焊剂；钎料；热界面材料；溅射靶材；铟、镓、锗、锡金属和无机化合物；以及 NanoFoil®。Indium 公司成立于 1934 年，在中国、马来西亚、新加坡、韩国、英国和美国拥有全球性的技术支持和工厂。
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