Indium Corporation’s Tim Jensen, Senior Product Manager for Engineered Solder Materials, will participate in a Global SMT & Packaging debate on thermal interface materials (TIMs) at 10:45 a.m. US Eastern Time/3:45 p.m. London Time/10:45 p.m. Malaysia Time on June 23.
Increasing miniaturization and reduced board real estate are driving the industry to look for more effective TIMs to evacuate the heat away from sensitive devices. In the panel Thermal Interface Materials (TIMs)—Driving the Heat Out of the Process, speakers will examine and discuss the various thermal interface materials available, their use cases, and effectiveness. The debate will be followed by a live Q&A session.
For more information or to register for the debate, visit https://us02web.zoom.us/webinar/register/WN_9cOnQmDEQkC7h4Mf4QXT3A.
If you’re looking for more technical content from Indium Corporation experts, register for an upcoming InSIDER Series webinar at https://www.indium.com/webinar.
Jensen has more than 20 years of experience working with customers troubleshooting and optimizing SMT process lines and solving defects, such as head-in-pillow, graping, and QFN voiding. Jensen has worked directly on hundreds of surface mount lines and developed a number of different products. Using that direct knowledge and expertise, he works closely with Indium Corporation’s technical service, sales, and research and development teams to develop cutting-edge products that address the unique challenges faced by the electronics assembly industry. As a senior product manager, Jensen is responsible for Indium Corporation’s most diverse product group, which includes solder preforms, wire, ribbon and foil, as well as thermal interface materials. He has authored many process and technical guidelines and has presented at numerous industry forums and conferences. In addition to his responsibilities at Indium Corporation, Tim also serves on the SMTA’s Board of Directors. In this role, he is part of the Strategic Development Committee where he leads the effort on international expansion. He earned his bachelor’s degree in chemical engineering from Clarkson University and his master’s in business administration from Syracuse University.
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 이 회사는 중국, 인도, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
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