Indium Corporation’s Tim Jensen, Senior Product Manager for Engineered Solder Materials, will participate in a Global SMT & Packaging debate on thermal interface materials (TIMs) at 10:45 a.m. US Eastern Time/3:45 p.m. London Time/10:45 p.m. Malaysia Time on June 23.
Increasing miniaturization and reduced board real estate are driving the industry to look for more effective TIMs to evacuate the heat away from sensitive devices. In the panel Thermal Interface Materials (TIMs)—Driving the Heat Out of the Process, speakers will examine and discuss the various thermal interface materials available, their use cases, and effectiveness. The debate will be followed by a live Q&A session.
For more information or to register for the debate, visit https://us02web.zoom.us/webinar/register/WN_9cOnQmDEQkC7h4Mf4QXT3A.
If you’re looking for more technical content from Indium Corporation experts, register for an upcoming InSIDER Series webinar at https://www.indium.com/webinar.
Jensen has more than 20 years of experience working with customers troubleshooting and optimizing SMT process lines and solving defects, such as head-in-pillow, graping, and QFN voiding. Jensen has worked directly on hundreds of surface mount lines and developed a number of different products. Using that direct knowledge and expertise, he works closely with Indium Corporation’s technical service, sales, and research and development teams to develop cutting-edge products that address the unique challenges faced by the electronics assembly industry. As a senior product manager, Jensen is responsible for Indium Corporation’s most diverse product group, which includes solder preforms, wire, ribbon and foil, as well as thermal interface materials. He has authored many process and technical guidelines and has presented at numerous industry forums and conferences. In addition to his responsibilities at Indium Corporation, Tim also serves on the SMTA’s Board of Directors. In this role, he is part of the Strategic Development Committee where he leads the effort on international expansion. He earned his bachelor’s degree in chemical engineering from Clarkson University and his master’s in business administration from Syracuse University.
Indium Corporation 是全球电子、半导体、薄膜和热管理市场的主要材料制造商和供应商。产品包括焊料和助焊剂；钎料；热界面材料；溅射靶材；铟、镓、锗、锡金属和无机化合物；以及 NanoFoil®。公司成立于 1934 年，拥有全球技术支持，在中国、印度、马来西亚、新加坡、韩国、英国和美国均设有工厂。
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