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Indium Corporation Expert to Present at IPC WorksAsia Shenzhen Technical Conference

Indium Corporation’s Andy Wei, PCBA Product Manager for China, will share his technical expertise at the IPC WorksAsia Technical Conference (Shenzhen) on June 23 in Shenzhen, China. The conference focuses on automotive electronics reliability.

Wei’s presentation, High-Reliability Alloy Solder Paste for Automotive Applications, will include:

  • An overview of the automotive electronics market
  • Key performance requirements for automotive electronics
  • Details on how to achieve high-reliability in automotive applications

Wei provides technical support for Indium Corporation’s electronics assembly materials for customers in China. He has more than 14 years of experience in electronics assembly, providing field support for soldering materials and SMT process applications. Wei earned his degree in electric engineering and automation from Zhengzhou Industrial Academy. He is an SMTA-Certified Process Engineer and is a Six Sigma Green Belt.

Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.

For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.