Indium Corporation’s Andy Wei, PCBA Product Manager for China, will share his technical expertise at the IPC WorksAsia Technical Conference (Shenzhen) on June 23 in Shenzhen, China. The conference focuses on automotive electronics reliability.
Wei’s presentation, High-Reliability Alloy Solder Paste for Automotive Applications, will include:
- An overview of the automotive electronics market
- Key performance requirements for automotive electronics
- Details on how to achieve high-reliability in automotive applications
Wei provides technical support for Indium Corporation’s electronics assembly materials for customers in China. He has more than 14 years of experience in electronics assembly, providing field support for soldering materials and SMT process applications. Wei earned his degree in electric engineering and automation from Zhengzhou Industrial Academy. He is an SMTA-Certified Process Engineer and is a Six Sigma Green Belt.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
