Three Indium Corporation experts willshare their expertise at the SMTA China East Technology Conference on April 24-26 in Shanghai, China.
Wisdom Qu, Area Tech Manager, Eastern China, will present Printing Process Design for High-Density, Low-Space Components. This presentation examines the impact of miniaturization on the printing process as PCBs in electronic assemblies become denser and more compact, potentially leading to insufficient solder deposits or skipped areas during printing. Qu will also share process recommendations, including stencil types, stencil under wiping methods, and solvent selections to achieve good printing.
Fiona Chen, Manager of Research & Development, will present Novel Fluxes with Decreased Viscosity After Reflow for Flip-Chip and SiP Assembly. While a tacky flux is necessary to secure the chip during handling and reflow, the reflow itself can increase the tackiness of the flux. This can impede the operator’s ability to remove the flux residue after reflow in order to achieve high reliability. Chen’s presentation will review a novel flux solution to this challenge.
Evan Yin, Assistant Manager for Indium Corporation’s Process Development Lab in Suzhou, China, will present Impact of Stencil Quality & Technology on Solder Paste Printing Performance. His presentation examines the impact of increased miniaturization in packaging and board-level assembly as part of the Internet of Things (IoT). As the industry moves to smaller and finer pitches, screen printing becomes a critical process with little if any margin for error when producing high quality electronics assemblies.
Qu provides technical support for Indium Corporation's electronics assembly materials, semiconductor and advanced assembly materials, and epoxy flux products. Based in Suzhou, Qu has extensive experience in surface-mount technology and is an SMTA Certified Process Engineer.
Chen is the Manager of Research & Development at Indium Corporation’s Suzhou facility. She is responsible for new technology and product development and is working on the development of electronics SMT assembly solder materials with an emphasis on new flux chemistry development for lead-free soldering applications.
Yinis responsible for equipment engineering at Indium Corporation’s Process Development Lab in Suzhou, PRC. He provides technical support and services, such as product and process recommendations and troubleshooting, and conducts product evaluations and qualifications. Yin has worked in the surface mount technology field for more than 15 years.
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 이 회사는 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
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