Three Indium Corporation experts willshare their expertise at the SMTA China East Technology Conference on April 24-26 in Shanghai, China.
Wisdom Qu, Area Tech Manager, Eastern China, will present Printing Process Design for High-Density, Low-Space Components. This presentation examines the impact of miniaturization on the printing process as PCBs in electronic assemblies become denser and more compact, potentially leading to insufficient solder deposits or skipped areas during printing. Qu will also share process recommendations, including stencil types, stencil under wiping methods, and solvent selections to achieve good printing.
Fiona Chen, Manager of Research & Development, will present Novel Fluxes with Decreased Viscosity After Reflow for Flip-Chip and SiP Assembly. While a tacky flux is necessary to secure the chip during handling and reflow, the reflow itself can increase the tackiness of the flux. This can impede the operator’s ability to remove the flux residue after reflow in order to achieve high reliability. Chen’s presentation will review a novel flux solution to this challenge.
Evan Yin, Assistant Manager for Indium Corporation’s Process Development Lab in Suzhou, China, will present Impact of Stencil Quality & Technology on Solder Paste Printing Performance. His presentation examines the impact of increased miniaturization in packaging and board-level assembly as part of the Internet of Things (IoT). As the industry moves to smaller and finer pitches, screen printing becomes a critical process with little if any margin for error when producing high quality electronics assemblies.
Qu provides technical support for Indium Corporation's electronics assembly materials, semiconductor and advanced assembly materials, and epoxy flux products. Based in Suzhou, Qu has extensive experience in surface-mount technology and is an SMTA Certified Process Engineer.
Chen is the Manager of Research & Development at Indium Corporation’s Suzhou facility. She is responsible for new technology and product development and is working on the development of electronics SMT assembly solder materials with an emphasis on new flux chemistry development for lead-free soldering applications.
Yinis responsible for equipment engineering at Indium Corporation’s Process Development Lab in Suzhou, PRC. He provides technical support and services, such as product and process recommendations and troubleshooting, and conducts product evaluations and qualifications. Yin has worked in the surface mount technology field for more than 15 years.
铟泰公司 是一家面向全球电子、半导体、薄膜及热管理 市场的顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊 ；热界面材料；溅射靶材 ；铟、镓（Ga） 、锗和锡等金属及无机材料化合物 ；以及NanoFoil®。该公司成立于1934年，拥有全球技术支持网络，并在中国、马来西亚 、新加坡 、韩国、英国和美国设有工厂。
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