Indium Corporation experts will share their industry knowledge and skill at SMTA International from Oct. 14-18 in Rosemont, Ill.
The following technical papers from Indium Corporation experts will be featured:
- Robust SMT No-Clean Solder Paste for SiP and 01005 Assembly by Dr. Ning-Cheng Lee, Vice President of Technology
- Low-Melting Point Materials Development: Novel High Reliability Low-Temperature Solder Alloys by Dr. Ning-Cheng Lee
- Novel High-Reliability Low-Temperature Solder Alloys by Dr. Lee
- Process and Materials Interaction Investigation: Test Methods for Electrochemical Consistency in PCB Assembly Processes – Revisited by Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials
- Solder Paste Rheology, Performance and Aging: How Worst-Case Shipping Scenarios Affect Solder-Paste Performance: Part 2 by Brook Sandy-Smith
- Reflow Profiling for Next-Generation Pb-free Solder Alloys by Brook Sandy-Smith
- Inspection Applications: Practical Implementation of Assembly Process for Low-Melting Point Solder Pastes by Brook Sandy-Smith
- Solder Printing: Impact of Stencil Quality & Technology on Solder Paste Printing Performance by Jonas Sjoberg, Technical Manager
- Reliability of Intermetallics in Various Interconnects: Copper-Tin Intermetallics: Their Importance, Growth Rate, and Nature by Dr. Ron Lasky, Senior Technologist
Indium Corporation experts will also serve as chairs for three technical sessions, including:
- Solder Paste Development to Overcome Component Challenges: Adam Murling, Technical Support Engineer, Global Accounts
- Low-Temperature Solder Paste and its Process Development – iNEMI Project: Anny Zhang, Regional Sales Manager, Northwestern USA, and Western Canada
- Properties and Behavior of Solders Containing Bismuth: Brook Sandy-Smith
Additionally, Dr. Lee will lead a workshop on Achieving High-Reliability for Lead-Free Solder Joints – Materials Consideration, and Brook Sandy-Smith will host Rising Expectations for “High-Reliability”—a spotlight series panel discussion.
SMTAI is a world-class electronics manufacturing conference and exhibition organized by the SMTA — the world's leading user group for surface mount and companion technologies. The conference provides high-quality technical information and networking opportunities.
인듐 코퍼레이션(Indium Corporation)은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 소재를 공급하는 선도적인 제조사이자 공급업체입니다. 주요 제품으로는 솔더 및 플럭스, 브레이징 재료, 열전도성 인터페이스 재료, 스퍼터링 타겟, 인듐·갈륨·게르마늄·주석 금속 및 무기 화합물, 그리고 NanoFoil® 등이 있습니다. 1934년에 설립된 이 회사는 전 세계적인 기술 지원 체계를 갖추고 있으며, 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 공장을 운영하고 있습니다.
인듐 코퍼레이션(Indium Corporation)에 대한 자세한 정보는indiumstg.wpenginepowered.com을방문하거나[email protected]으로 이메일을 보내 주시기 바랍니다. 또한www.facebook.com/indium또는@IndiumCorp에서 당사의 전문가 그룹인 From One Engineer ToAnother®(#FOETA)를 팔로우하실 수 있습니다.
