Indium Corporation experts will share their industry knowledge and skill at SMTA International from Oct. 14-18 in Rosemont, Ill.
The following technical papers from Indium Corporation experts will be featured:
- Robust SMT No-Clean Solder Paste for SiP and 01005 Assembly by Dr. Ning-Cheng Lee, Vice President of Technology
- Low-Melting Point Materials Development: Novel High Reliability Low-Temperature Solder Alloys by Dr. Ning-Cheng Lee
- Novel High-Reliability Low-Temperature Solder Alloys by Dr. Lee
- Process and Materials Interaction Investigation: Test Methods for Electrochemical Consistency in PCB Assembly Processes – Revisited by Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials
- Solder Paste Rheology, Performance and Aging: How Worst-Case Shipping Scenarios Affect Solder-Paste Performance: Part 2 by Brook Sandy-Smith
- Reflow Profiling for Next-Generation Pb-free Solder Alloys by Brook Sandy-Smith
- Inspection Applications: Practical Implementation of Assembly Process for Low-Melting Point Solder Pastes by Brook Sandy-Smith
- Solder Printing: Impact of Stencil Quality & Technology on Solder Paste Printing Performance by Jonas Sjoberg, Technical Manager
- Reliability of Intermetallics in Various Interconnects: Copper-Tin Intermetallics: Their Importance, Growth Rate, and Nature by Dr. Ron Lasky, Senior Technologist
Indium Corporation experts will also serve as chairs for three technical sessions, including:
- Solder Paste Development to Overcome Component Challenges: Adam Murling, Technical Support Engineer, Global Accounts
- Low-Temperature Solder Paste and its Process Development – iNEMI Project: Anny Zhang, Regional Sales Manager, Northwestern USA, and Western Canada
- Properties and Behavior of Solders Containing Bismuth: Brook Sandy-Smith
Additionally, Dr. Lee will lead a workshop on Achieving High-Reliability for Lead-Free Solder Joints – Materials Consideration, and Brook Sandy-Smith will host Rising Expectations for “High-Reliability”—a spotlight series panel discussion.
SMTAI is a world-class electronics manufacturing conference and exhibition organized by the SMTA — the world's leading user group for surface mount and companion technologies. The conference provides high-quality technical information and networking opportunities.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、および熱管理市場向けに、最先端の材料を製造・供給する主要企業です。 製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズなどの金属および無機化合物、ならびにNanoFoil®が含まれます。1934年に設立された同社は、世界的な技術サポート体制を整備しており、中国、マレーシア、シンガポール、韓国、英国、米国に工場を構えています。
インジウム・コーポレーションに関する詳細については、indiumstg.wpenginepowered.comをご覧いただくか、[email protected] までメールでお問い合わせください。また、当社の専門家による「From One Engineer ToAnother®（#FOETA）」を、www.facebook.com/indiumまたは@IndiumCorp でフォローすることもできます。
