Indium Corporation will feature its portfolio of high-reliability solutions for power electronics at the Applied Power Electronics Conference (APEC), March 15-19 in New Orleans, La., USA.
Indium Corporation's solder and thermal solutions for power electronics include the following:
- InFORMS® reinforced solder alloy fabrications improve mechanical and thermal reliability while ensuring uniform bondline thickness. They also address specific challenges of the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
- QuickSinter® silver sintering paste delivers consistent, high-speed sintering on a variety of surfaces and die metallizations. QuickSinter works well in both high- and low-temperature pressureless applications. It can be used for discretes, small modules, and integrated power modules.
- Metal thermal interface materials (TIMs) are available for a wide variety of applications and process challenges. Our Heat-Spring® TIM offers uniform thermal resistance with minimized surface resistance and increased heat flow. The HSMF is a compressible TIM that is ideal for large area thermal interface requirements, such as IGBTs.
For more information, visit Indium Corporation's experts at the show at booth 1905.
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 이 회사는 중국, 인도, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
