Indium Corporation will feature its portfolio of high-reliability solutions for power electronics at the Applied Power Electronics Conference (APEC), March 15-19 in New Orleans, La., USA.
Indium Corporation's solder and thermal solutions for power electronics include the following:
- InFORMS® reinforced solder alloy fabrications improve mechanical and thermal reliability while ensuring uniform bondline thickness. They also address specific challenges of the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
- QuickSinter® silver sintering paste delivers consistent, high-speed sintering on a variety of surfaces and die metallizations. QuickSinter works well in both high- and low-temperature pressureless applications. It can be used for discretes, small modules, and integrated power modules.
- Metal thermal interface materials (TIMs) are available for a wide variety of applications and process challenges. Our Heat-Spring® TIM offers uniform thermal resistance with minimized surface resistance and increased heat flow. The HSMF is a compressible TIM that is ideal for large area thermal interface requirements, such as IGBTs.
For more information, visit Indium Corporation's experts at the show at booth 1905.
铟泰公司 面向全球电子、半导体、薄膜及热管理 顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。公司成立于1934年，拥有全球技术支持网络，并在中国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
