Indium Corporation will feature its portfolio of high-reliability solutions for power electronics at the Applied Power Electronics Conference (APEC), March 15-19 in New Orleans, La., USA.
Indium Corporation's solder and thermal solutions for power electronics include the following:
- InFORMS® reinforced solder alloy fabrications improve mechanical and thermal reliability while ensuring uniform bondline thickness. They also address specific challenges of the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
- QuickSinter® silver sintering paste delivers consistent, high-speed sintering on a variety of surfaces and die metallizations. QuickSinter works well in both high- and low-temperature pressureless applications. It can be used for discretes, small modules, and integrated power modules.
- Metal thermal interface materials (TIMs) are available for a wide variety of applications and process challenges. Our Heat-Spring® TIM offers uniform thermal resistance with minimized surface resistance and increased heat flow. The HSMF is a compressible TIM that is ideal for large area thermal interface requirements, such as IGBTs.
For more information, visit Indium Corporation's experts at the show at booth 1905.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがある。1934年に設立され、グローバルな技術サポートと中国、インド、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
インジウム・コーポレーションについての詳細は、www.indium.comをご覧いただくか、[email protected] まで電子メールでお問い合わせください。また、当社の専門家であるFrom One Engineer ToAnother®(#FOETA)を、www.facebook.com/indiumまたは@IndiumCorp でフォローすることもできます。
