Indium Corporation will feature its new combined flip-chip and ball-attach flux, designed to provide a simple solution to SiP and flip-chip BGA assembly, at IEEE EPTC Singapore 2019, December 4-6, in Singapore.
WS-446HF is a water-soluble, halogen-free flux with an activator system powerful enough to promote good wetting on the most demanding surfaces, including solder-on-pad (SoP), Cu-OSP, ENIG, and surfaces used in embedded trace substrate (ETS), and flip-chip on leadframe (FCOL) .
WS-446HF provides:
- An activator chemistry powerful enough to deal with a variety of metallizations, yet cleans away completely to eliminate electrical failures such as dendrites. This is critical for fine-pitch flip-chip applications
- Tackiness suitable for flipchip and BGA assembly
- BGA: holding 0.15–0.5mm diameter solder spheres during reflow, eliminating missing balls
- Flip-chip: Retaining 5×5–15x15mm die in place during reflow, reducing die misalignment and die tilt
- Consistent deposition in pin transfer, printing, and dipping processes, ensuring consistent joint quality and improving production yields
- Elimination of multiple fluxing steps, especially in ball-attach assembly, enabling a single-step ball-attach process thus removing the warpage-inducing effects of prefluxing
- Good cleanability with room temperature DI water (20-35°C), avoiding the formation of white residue
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 이 회사는 중국, 인도, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
