Indium Corporation will feature its new combined flip-chip and ball-attach flux, designed to provide a simple solution to SiP and flip-chip BGA assembly, at IEEE EPTC Singapore 2019, December 4-6, in Singapore.
WS-446HF is a water-soluble, halogen-free flux with an activator system powerful enough to promote good wetting on the most demanding surfaces, including solder-on-pad (SoP), Cu-OSP, ENIG, and surfaces used in embedded trace substrate (ETS), and flip-chip on leadframe (FCOL) .
WS-446HF provides:
- An activator chemistry powerful enough to deal with a variety of metallizations, yet cleans away completely to eliminate electrical failures such as dendrites. This is critical for fine-pitch flip-chip applications
- Tackiness suitable for flipchip and BGA assembly
- BGA: holding 0.15–0.5mm diameter solder spheres during reflow, eliminating missing balls
- Flip-chip: Retaining 5×5–15x15mm die in place during reflow, reducing die misalignment and die tilt
- Consistent deposition in pin transfer, printing, and dipping processes, ensuring consistent joint quality and improving production yields
- Elimination of multiple fluxing steps, especially in ball-attach assembly, enabling a single-step ball-attach process thus removing the warpage-inducing effects of prefluxing
- Good cleanability with room temperature DI water (20-35°C), avoiding the formation of white residue
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