Indium Corporation’s Graham Wilson, applications engineer, will present at Brasage in Brest, France on Friday, May 23.
Wilson’s presentation, Elimination of Head-in-Pillow in PoP Assembly: A Flux Approach, discusses eliminating head-in-pillow defects in the package-on-package (PoP) assembly process by engineering unique attributes of the flux chemistries of dipping fluxes and pastes.
For more information, visit afeit.asso.fr/brasage-2014.
Wilson is responsible for providing comprehensive technical advice in the selection, use, and application of solder pastes, fluxes, and engineered solders to customers in the electronics assembly, optoelectronics, thermal management, semiconductor packaging, and related industries. He is based in the United Kingdom and has over 20 years of experience in electronics assembly, including Pb-free process implementation, production engineering, RoHS compliance, and component finishes. Wilson has a degree in HNC Electronics from Nene University in Northampton, England, and is certified as a Six Sigma Green Belt through Dartmouth College’s Thayer School of Engineering
Organized for more than 15 years, Brasage is now a reoccurring event for the electronics industry, recognized and respected by the profession. This year, printed circuits, brazing, PCB assembly, reliability, and the future of the electronics industry will be the main topics.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
인디엄 코퍼레이션에 대한 자세한 내용은 www.indium.com 또는 이메일 ([email protected])로 문의하세요.
