Indium Corporation’s Graham Wilson, applications engineer, will present at Brasage in Brest, France on Friday, May 23.
Wilson’s presentation, Elimination of Head-in-Pillow in PoP Assembly: A Flux Approach, discusses eliminating head-in-pillow defects in the package-on-package (PoP) assembly process by engineering unique attributes of the flux chemistries of dipping fluxes and pastes.
For more information, visit afeit.asso.fr/brasage-2014.
Wilson is responsible for providing comprehensive technical advice in the selection, use, and application of solder pastes, fluxes, and engineered solders to customers in the electronics assembly, optoelectronics, thermal management, semiconductor packaging, and related industries. He is based in the United Kingdom and has over 20 years of experience in electronics assembly, including Pb-free process implementation, production engineering, RoHS compliance, and component finishes. Wilson has a degree in HNC Electronics from Nene University in Northampton, England, and is certified as a Six Sigma Green Belt through Dartmouth College’s Thayer School of Engineering
Organized for more than 15 years, Brasage is now a reoccurring event for the electronics industry, recognized and respected by the profession. This year, printed circuits, brazing, PCB assembly, reliability, and the future of the electronics industry will be the main topics.
Indium Corporation 是全球電子、半導體、太陽能、薄膜及熱管理市場的首屈一指的材料製造商與供應商。 產品涵蓋焊料與助焊劑、釬料、熱界面材料、濺鍍靶材、銦、鎵、鍺及錫等金屬與無機化合物，以及 NanoFoil®。銦公司成立於 1934 年，擁有全球技術支援體系，並在中國、新加坡、南韓、英國及美國設有工廠。
如需進一步了解 Indium Corporation，請造訪indiumstg.wpenginepowered.com或發送電子郵件至[email protected]。
