Indium Corporation’s Graham Wilson, applications engineer, will present at Brasage in Brest, France on Friday, May 23.
Wilson’s presentation, Elimination of Head-in-Pillow in PoP Assembly: A Flux Approach, discusses eliminating head-in-pillow defects in the package-on-package (PoP) assembly process by engineering unique attributes of the flux chemistries of dipping fluxes and pastes.
For more information, visit afeit.asso.fr/brasage-2014.
Wilson is responsible for providing comprehensive technical advice in the selection, use, and application of solder pastes, fluxes, and engineered solders to customers in the electronics assembly, optoelectronics, thermal management, semiconductor packaging, and related industries. He is based in the United Kingdom and has over 20 years of experience in electronics assembly, including Pb-free process implementation, production engineering, RoHS compliance, and component finishes. Wilson has a degree in HNC Electronics from Nene University in Northampton, England, and is certified as a Six Sigma Green Belt through Dartmouth College’s Thayer School of Engineering
Organized for more than 15 years, Brasage is now a reoccurring event for the electronics industry, recognized and respected by the profession. This year, printed circuits, brazing, PCB assembly, reliability, and the future of the electronics industry will be the main topics.
Indium Corporation 是全球电子、半导体、太阳能、薄膜和热管理市场的主要材料制造商和供应商。产品包括焊料和助焊剂；钎料；热界面材料；溅射靶材；铟、镓、锗、锡金属和无机化合物；以及 NanoFoil®。Indium 公司成立于 1934 年，在中国、新加坡、韩国、英国和美国都有全球技术支持和工厂。
有关 Indium Corporation 的更多信息，请访问www.indium.com或发送电子邮件至 [email protected]。
