Indium Corporation will feature its ultra-reliable Indium8.9HF Solder Paste series at Productronica China, March 20-22, in Shanghai, China.
The Indium8.9HF series is an air reflow, no-clean solder paste suite specially formulated to accommodate the higher processing temperatures required by the SnAgCu (SAC), SnAg, and other alloy systems favored by the automotive electronics industry.
The Indium8.9HF series delivers no-clean halogen-free solder paste solutions designed to produce low-voiding and improved stability during the printing process. The series also:
- Demonstrates consistent printing and reflow performance for up to 12 months in refrigerated storage
- 실온에서 한 달 동안 보관해도 우수한 인쇄 및 리플로우 성능 유지
- Delivers excellent response-to-pause printing performance, even after being left on the stencil for 60 hours
Indium8.9HF enhances the reliability of automotive products in two ways:
- Increases electrical reliability via enhanced surface insulation resistance (SIR) that inhibits current leakage and dendritic growth
- Improves thermal reliability due to its low-voiding performance on bottom terminating components (BTCs), reducing the risk of application or product failure
For more information about Indium8.9HF Solder Paste, visit indiumstg.wpenginepowered.com/avoidthevoid or stop by booth #E2.2514 at the show.
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 이 회사는 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
