Indium Corporation will feature its ultra-reliable Indium8.9HF Solder Paste series at Productronica China, March 20-22, in Shanghai, China.
The Indium8.9HF series is an air reflow, no-clean solder paste suite specially formulated to accommodate the higher processing temperatures required by the SnAgCu (SAC), SnAg, and other alloy systems favored by the automotive electronics industry.
The Indium8.9HF series delivers no-clean halogen-free solder paste solutions designed to produce low-voiding and improved stability during the printing process. The series also:
- 在冷藏儲存長達 12 個月的時間內，仍可展現一致的印刷與回流焊效能
- 在室溫下放置一個月後，仍可維持優異的印刷與回流焊效能
- Delivers excellent response-to-pause printing performance, even after being left on the stencil for 60 hours
Indium8.9HF enhances the reliability of automotive products in two ways:
- 透過增強表面絕緣電阻 (SIR)，抑制電流洩漏和樹枝狀生長，提高電氣可靠性
- Improves thermal reliability due to its low-voiding performance on bottom terminating components (BTCs), reducing the risk of application or product failure
For more information about Indium8.9HF Solder Paste, visit indiumstg.wpenginepowered.com/avoidthevoid or stop by booth #E2.2514 at the show.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
