Indium Corporation will feature its ultra-reliable Indium8.9HF Solder Paste series at Productronica China, March 20-22, in Shanghai, China.
The Indium8.9HF series is an air reflow, no-clean solder paste suite specially formulated to accommodate the higher processing temperatures required by the SnAgCu (SAC), SnAg, and other alloy systems favored by the automotive electronics industry.
The Indium8.9HF series delivers no-clean halogen-free solder paste solutions designed to produce low-voiding and improved stability during the printing process. The series also:
- Demonstrates consistent printing and reflow performance for up to 12 months in refrigerated storage
- Maintains excellent printing and reflow performance after remaining at room temperature for one month
- Delivers excellent response-to-pause printing performance, even after being left on the stencil for 60 hours
Indium8.9HF enhances the reliability of automotive products in two ways:
- 表面絶縁抵抗(SIR)の向上により、電流リークと樹枝状突起の成長を抑制し、電気的信頼性を高めます。
- Improves thermal reliability due to its low-voiding performance on bottom terminating components (BTCs), reducing the risk of application or product failure
For more information about Indium8.9HF Solder Paste, visit indiumstg.wpenginepowered.com/avoidthevoid or stop by booth #E2.2514 at the show.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがある。1934年に設立され、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
