Indium Corporation will feature its new ultra-low voiding Indium10.1HF Solder Paste—which helps customers Avoid the Void®—at Productronica China 2018, March 14-16, 2018, in Shanghai.
Indium10.1HF is an air reflow, no-clean, halogen-free, Pb-free solder paste specifically formulated to achieve ultra-low voiding, especially in bottom termination component (BTC) assemblies.
Indium10.1HF has a flux chemistry engineered to improve reliability with:
- 낮은 스탠드오프 구성 요소, 적절한 환기가 없는 RF 차폐, 낮은 간격의 캐비티에 있는 구성 요소에서 높은 ECM 성능 제공
- 납땜 비딩 최소화
- 매우 낮은 브리징, 슬럼프 및 납땜 볼링
- 다양한 일반 신선 및 노화 금속화 및 표면 마감에 탁월한 습윤성 제공
- 낮은 변동으로 높은 인쇄 전송 효율성
Indium10.1HF is compatible with lead-free alloys such as SnAgCu, SnAg, and other alloy systems favored by the electronics industry. This solder paste is halogen-free per IEC 61249-2-21, test method EN 14582.
For more information about Indium Corporation’s low-voiding solder pastes, visit indiumstg.wpenginepowered.com/avoidthevoid or see Indium Corporation at booth E2.2330.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
