Indium Corporation will feature its new ultra-low voiding Indium10.1HF Solder Paste—which helps customers Avoid the Void®—at Productronica China 2018, March 14-16, 2018, in Shanghai.
Indium10.1HF is an air reflow, no-clean, halogen-free, Pb-free solder paste specifically formulated to achieve ultra-low voiding, especially in bottom termination component (BTC) assemblies.
Indium10.1HF has a flux chemistry engineered to improve reliability with:
- 在低間距元件、無適當通風的 RF 遮罩，以及低淨空空腔中的元件下，具有高 ECM 效能
- 焊錫珠最小化
- 非常低的橋接、坍落度和焊錫球化
- 對各種常見的新舊金屬化和表面處理有極佳的潤濕性
- 印刷傳輸效率高、變化小
Indium10.1HF is compatible with lead-free alloys such as SnAgCu, SnAg, and other alloy systems favored by the electronics industry. This solder paste is halogen-free per IEC 61249-2-21, test method EN 14582.
For more information about Indium Corporation’s low-voiding solder pastes, visit www.indium.com/avoidthevoid or see Indium Corporation at booth E2.2330.
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer ToAnother®(#FOETA)。
