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Indium Corporation to Showcase Durafuse Technology at EPP InnovationsFORUM

Indium Corporation will showcase its innovative Durafuse technology at the EPP InnovationsFORUM on Tuesday, June 28 in Leinfelden-Echterdingen, Germany.

The harmful effects of lead on human health and the environment are driving the development of high-temperature lead-free (HTLF) solders to replace high-Pb solders for die-attachment and clip-bond in power device applications. Indium Corporations innovative Durafuse HT features a novel design based on a mixed-alloy technology, designed to deliver a tin-rich HTLF paste, presenting the merits of both constituent alloys. Durafuse HT delivers:

  • Simplified processing; Durafuse HT is a drop-in replacement for high-Pb solder, with no special equipment needed and minimal process adjustments
  • Enhanced thermal cycling reliability; equal or higher than high-Pb solder
  • Lower RDS(on) compared to high-Pb solder

Indium Corporations award-winning Durafuse LT is a patented low-temperature alloy system designed to provide high-reliability in low-temperature applications that require a reflow temperature below 210C. Durafuse LT delivers:

  • Improved drop shock performance more than two orders of magnitude better than Bi-containing low-temperature materials
  • Drop shock performance equal or better than SAC305 with proper process optimization
  • Ideal characteristics for step soldering and low-temperature requirements

인디엄 코퍼레이션 소개

Indium Corporation 은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재 정제, 제련, 제조 및 공급업체입니다. 제품에는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil 이 포함됩니다. 1934년에 설립된 이 회사는 중국, 독일, 인도, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.

인디움 코퍼레이션에 대한 자세한 정보는 www.indium.com 또는 징야 황에게 이메일을 보내주세요. 또한 From One Engineer To Another (#FOETA)의 전문가를 www.linkedin.com/company/indium-corporation/ 또는 @IndiumCorp에서 팔로우할 수도 있습니다.

About EPP InnovationsFORUM

The EPP InnovationsFORUM is the leading, independent event in the field of manufacturing electronic assemblies. Click here to learn more.