Indium Corporation will showcase its innovative Durafuse technology at the EPP InnovationsFORUM on Tuesday, June 28 in Leinfelden-Echterdingen, Germany.
The harmful effects of lead on human health and the environment are driving the development of high-temperature lead-free (HTLF) solders to replace high-Pb solders for die-attachment and clip-bond in power device applications. Indium Corporations innovative Durafuse HT features a novel design based on a mixed-alloy technology, designed to deliver a tin-rich HTLF paste, presenting the merits of both constituent alloys. Durafuse HT delivers:
- Simplified processing; Durafuse HT is a drop-in replacement for high-Pb solder, with no special equipment needed and minimal process adjustments
- Enhanced thermal cycling reliability; equal or higher than high-Pb solder
- Lower RDS(on) compared to high-Pb solder
Indium Corporations award-winning Durafuse LT is a patented low-temperature alloy system designed to provide high-reliability in low-temperature applications that require a reflow temperature below 210C. Durafuse LT delivers:
- Improved drop shock performance more than two orders of magnitude better than Bi-containing low-temperature materials
- Drop shock performance equal or better than SAC305 with proper process optimization
- Ideal characteristics for step soldering and low-temperature requirements
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以透過www.linkedin.com/company/indium-corporation/或@IndiumCorp 追蹤我們的專家，From One Engineer To Another (#FOETA)。
About EPP InnovationsFORUM
The EPP InnovationsFORUM is the leading, independent event in the field of manufacturing electronic assemblies. Click here to learn more.
