Indium Corporation will showcase its innovative Durafuse technology at the EPP InnovationsFORUM on Tuesday, June 28 in Leinfelden-Echterdingen, Germany.
The harmful effects of lead on human health and the environment are driving the development of high-temperature lead-free (HTLF) solders to replace high-Pb solders for die-attachment and clip-bond in power device applications. Indium Corporations innovative Durafuse HT features a novel design based on a mixed-alloy technology, designed to deliver a tin-rich HTLF paste, presenting the merits of both constituent alloys. Durafuse HT delivers:
- Simplified processing; Durafuse HT is a drop-in replacement for high-Pb solder, with no special equipment needed and minimal process adjustments
- Enhanced thermal cycling reliability; equal or higher than high-Pb solder
- Lower RDS(on) compared to high-Pb solder
Indium Corporations award-winning Durafuse LT is a patented low-temperature alloy system designed to provide high-reliability in low-temperature applications that require a reflow temperature below 210C. Durafuse LT delivers:
- Improved drop shock performance more than two orders of magnitude better than Bi-containing low-temperature materials
- Drop shock performance equal or better than SAC305 with proper process optimization
- Ideal characteristics for step soldering and low-temperature requirements
关于铟泰公司
Indium Corporation 是全球电子、半导体、薄膜和热管理市场的主要材料提炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；钎料；热界面材料；溅射靶材；铟、镓、锗、锡金属和无机化合物；以及 NanoFoil 。公司成立于 1934 年，在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国均设有工厂，并提供全球技术支持。
有关 Indium Corporation 的更多信息，请访问www.indium.com或发送电子邮件至Jingya Huang。您还可以通过www.linkedin.com/company/indium-corporation/或@IndiumCorp 关注我们的专家，From One Engineer To Another (#FOETA) 。
About EPP InnovationsFORUM
The EPP InnovationsFORUM is the leading, independent event in the field of manufacturing electronic assemblies. Click here to learn more.
