Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology, will present at the Medical Electronics Symposium Sept. 18-19 in Portland, Ore.
Dr. Lee will present The Application of Second Generation SACm™ Solder Alloy in Both Solder Spheres and Solder Paste. This presentation discusses how SACm0510 solder alloy, the next generation of SACm, performs versus other SAC alloys. Results show that the low silver-containing SACm0510 provides a superior, more cost-effective option for solving the common assembly problems of fragile solder joints and compromised thermal cycling performance.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on both high performance and low cost of ownership.
The Medical Electronics Symposium is an international conference organized by INEMI, MEPTEC, and the SMTA. This event focuses on advances in electronics assembly technologies for advanced manufacturing, specifically targeting medical and bioscience applications. For more information, visit www.smta.org/medical.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
