Indium Corporation‘s Karthik Vijayamadhavan is scheduled to present at the European Electronics Assembly Reliability Summit September 21-23, 2010 in Tallinn, Estonia.
The presentation, "Solder Paste Attributes for Maximizing the Print & Reflow Process Windows," focuses on SMT assembly challenges, such as maximizing paste transfer and achieving consistent print deposits for small apertures; eliminating head-in-pillow; and preventing clumpy/grainy solder joints on small components that see long reflow profiles.
Karthik has recently been named Technical Manager for Indium Corporation’s European Operations. Prior to his promotion, he was an Area Sales Manager, based in San Jose, CA, USA. He has a bachelor’s degree in Mechanical Engineering from the University of Madras-India and a master’s degree in Industrial Engineering from the State University of New York at Binghamton.
Karthik is an SMTA-certified engineer and earned his Six Sigma Green-Belt certification from Dartmouth College’s Thayer School of Engineering. Karthik has over nine years of experience in the surface mount technology industry. He is based in Milton Keynes, UK.
The European Electronics Assembly Reliability Summit brings together experts and provides a unique opportunity to examine, learn, and debate business-critical issues through industry discussion, technical collaboration, and information sharing.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 공급하는 기업입니다. 주요 제품으로는 솔더, 프리폼 및 플럭스, 브레이즈, 스퍼터 타겟, 인듐, 갈륨, 게르마늄 화학물질 및 소싱, 반응성 나노포일® 등이 있습니다. 1934년에 설립된 Indium은 중국, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about the European Electronics Assembly Reliability Summit, visit http://www.globalsmt.net/ers/wp/.
인디엄 코퍼레이션에 대한 자세한 내용은 www.indium.com 또는 이메일 [email protected] 에서 확인하세요.
