Indium Corporation‘s Karthik Vijayamadhavan is scheduled to present at the European Electronics Assembly Reliability Summit September 21-23, 2010 in Tallinn, Estonia.
The presentation, "Solder Paste Attributes for Maximizing the Print & Reflow Process Windows," focuses on SMT assembly challenges, such as maximizing paste transfer and achieving consistent print deposits for small apertures; eliminating head-in-pillow; and preventing clumpy/grainy solder joints on small components that see long reflow profiles.
Karthik has recently been named Technical Manager for Indium Corporation’s European Operations. Prior to his promotion, he was an Area Sales Manager, based in San Jose, CA, USA. He has a bachelor’s degree in Mechanical Engineering from the University of Madras-India and a master’s degree in Industrial Engineering from the State University of New York at Binghamton.
Karthik is an SMTA-certified engineer and earned his Six Sigma Green-Belt certification from Dartmouth College’s Thayer School of Engineering. Karthik has over nine years of experience in the surface mount technology industry. He is based in Milton Keynes, UK.
The European Electronics Assembly Reliability Summit brings together experts and provides a unique opportunity to examine, learn, and debate business-critical issues through industry discussion, technical collaboration, and information sharing.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料供應商。產品包括焊料、預成型品和助熔劑；钎料；濺鍍靶材；铟、鎵和锗化學品和採購；以及 Reactive NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠位於中國、新加坡、南韓、英國和美國。
For more information about the European Electronics Assembly Reliability Summit, visit http://www.globalsmt.net/ers/wp/.
如需有關 Indium Corporation 的更多資訊，請造訪www.indium.com或發送電子郵件至 [email protected]。
