Indium Corporation‘s Karthik Vijayamadhavan is scheduled to present at the European Electronics Assembly Reliability Summit September 21-23, 2010 in Tallinn, Estonia.
The presentation, "Solder Paste Attributes for Maximizing the Print & Reflow Process Windows," focuses on SMT assembly challenges, such as maximizing paste transfer and achieving consistent print deposits for small apertures; eliminating head-in-pillow; and preventing clumpy/grainy solder joints on small components that see long reflow profiles.
Karthik has recently been named Technical Manager for Indium Corporation’s European Operations. Prior to his promotion, he was an Area Sales Manager, based in San Jose, CA, USA. He has a bachelor’s degree in Mechanical Engineering from the University of Madras-India and a master’s degree in Industrial Engineering from the State University of New York at Binghamton.
Karthik is an SMTA-certified engineer and earned his Six Sigma Green-Belt certification from Dartmouth College’s Thayer School of Engineering. Karthik has over nine years of experience in the surface mount technology industry. He is based in Milton Keynes, UK.
The European Electronics Assembly Reliability Summit brings together experts and provides a unique opportunity to examine, learn, and debate business-critical issues through industry discussion, technical collaboration, and information sharing.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、太陽電池、薄膜、熱管理市場向けの一流材料サプライヤーです。製品には、はんだ、プリフォーム、フラックス、ろう材、スパッタターゲット、インジウム、ガリウム、ゲルマニウムの化学薬品および調達、Reactive NanoFoil®などがある。1934年に設立されたインジウムは、グローバルな技術サポートと中国、シンガポール、韓国、英国、米国に工場を有しています。
For more information about the European Electronics Assembly Reliability Summit, visit http://www.globalsmt.net/ers/wp/.
インジウム・コーポレーションについての詳細は、www.indium.comをご覧いただくか、[email protected] まで電子メールをお送りください。
