Indium Corporation‘s Karthik Vijayamadhavan is scheduled to present at the European Electronics Assembly Reliability Summit September 21-23, 2010 in Tallinn, Estonia.
The presentation, "Solder Paste Attributes for Maximizing the Print & Reflow Process Windows," focuses on SMT assembly challenges, such as maximizing paste transfer and achieving consistent print deposits for small apertures; eliminating head-in-pillow; and preventing clumpy/grainy solder joints on small components that see long reflow profiles.
Karthik has recently been named Technical Manager for Indium Corporation’s European Operations. Prior to his promotion, he was an Area Sales Manager, based in San Jose, CA, USA. He has a bachelor’s degree in Mechanical Engineering from the University of Madras-India and a master’s degree in Industrial Engineering from the State University of New York at Binghamton.
Karthik is an SMTA-certified engineer and earned his Six Sigma Green-Belt certification from Dartmouth College’s Thayer School of Engineering. Karthik has over nine years of experience in the surface mount technology industry. He is based in Milton Keynes, UK.
The European Electronics Assembly Reliability Summit brings together experts and provides a unique opportunity to examine, learn, and debate business-critical issues through industry discussion, technical collaboration, and information sharing.
铟泰公司 面向全球电子、半导体、太阳能、薄膜及热管理 顶级材料供应商。 产品包括焊料、焊片助焊剂；硬钎焊；溅射靶材；铟、镓（Ga）和锗的化学品及采购服务；以及Reactive NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持网络，并在中国、新加坡、韩国、英国和美国设有工厂。
For more information about the European Electronics Assembly Reliability Summit, visit http://www.globalsmt.net/ers/wp/.
如需了解有关铟泰公司 更多信息，铟泰公司 indiumstg.wpenginepowered.com或发送电子邮件至[email protected]。
