Several Indium Corporation technology experts will present at the Surface Mount Technology Association’s International Conference and Exhibition (SMTAi) on October 15-17 in Fort Worth, Texas.
Dr. Ning-Cheng Lee, Vice President of Technology, will give three presentations.
Voiding and Reliability of BGA Assemblies with SAC and 57Bi42Sn1Ag Alloys explores replacing SAC solders with BiSnAg as a low-cost solution. The joint mechanical strength, drop test performance, and voiding performance of these alloys were evaluated against their reflow profile.
Corrosion Resistance of High Melting Lead-free BiAgX Solder Joints compares the corrosion resistance of Pb5/Sn2.5/Ag and SAC305 with BiAgX®, a drop-in lead-free solder paste solution for high temperature die-attach applications.
The Second Generation Shock Resistance and Thermally Reliable Low Ag SAC Solder Doped with Mn discusses the considerable improvement in shock resistance and thermal fatigue performance of a new soldering alloy doped with Mn.
Tim Jensen, Product Manager of PCB Assembly Materials, will present Alloy and Process Optimization for Low-Ag Solders. This presentation reviews the differences and impact of alternative alloys to SAC305 on electronics assembly.
Jensen will also give a workshop titled Soldering Technology for SMT: Achieving High Yields and Reliability. This workshop provides a detailed discussion of solder materials, components, and PCBs, and how each is important when producing a complete electronics product that meets current and future legislative restrictions. He will also include a detailed discussion of process optimization and defect elimination in the assembly process.
Dr. Ron Lasky, Senior Technologist, will present Using Weibull Analysis to Interpret Failure Data in Electronics Assembly Stress Testing. This presentation explores how to use the Weibull function to analyze failure data in electronics assembly. Lasky will discuss several case studies that include multiple failure modes and early first fails.
Brook Sandy-Smith, Product Support Specialist – PCB Assembly Materials, will present four papers:
Optimizing Assembly of QFNs explores several tested and proven strategies to minimize voiding in QFN assemblies, including thermal pad design and patterning, via placement, and addition of a flux-coated solder preform.
Measuring Tiny Solder Deposits with Accuracy and Repeatability discusses advancements in paste deposit inspection equipment, allowing for more accurate characterization of tiny solder deposits. This is especially important to ensure repeatability of miniaturized assemblies.
Probe Technologies to Improve First Pass Yield looks at the impact that flux residue permeability has on the first-pass yield results. It also discusses the role that aperture design has on creating an optimal surface for contact.
Productivity and Profitability Assessment of Improved Pin Probe Testing uses a case study to compare solder pastes with different flux residue characteristics and first-pass yields for in-circuit tests. Sandy-Smith also discusses factors that impact profitability, such as probe cleanliness, the number of actuations required to ensure repeatable testing, and false positives.
Additionally, Indium Corporation technical experts will be chairing several sessions.
이 박사는 세계적으로 유명한 납땜 전문가이자 SMTA 우수 회원입니다. 그는 고온 폴리머, 마이크로 일렉트로닉스용 인캡슐런트, 언더필 및 접착제 개발 분야에서 폭넓은 경험을 보유하고 있습니다. 현재 그의 연구 분야는 전자 및 광전자 애플리케이션을 위한 인터커넥트 및 패키징용 첨단 소재이며, 고성능과 낮은 소유 비용에 중점을 두고 있습니다.
Jensen is an SMTA-certified process engineer. He earned his bachelor’s degree in chemical engineering from Clarkson University. He has spent over 15 years working with customers to troubleshoot and optimize SMT process lines, and solving issues such as head-in-pillow, graping, and QFN voiding. Through his direct work on hundreds of SMT lines, he understands each customer’s unique requirements and readily shares his expertise by authoring technical papers and writing for technical publications. He also participates actively in several IPC standards development committees.
Dr. Lasky, holder of the prestigious SMTA Founder’s Award, is a world-renown process expert and an Instructional Professor at Dartmouth College. He has over 25 years of experience in electronics and optoelectronic packaging and assembly. He has authored or edited five books and numerous technical papers and holds several patent disclosures. Dr. Lasky also authors a technology blog, which can be found at www.indium.com/drlasky.
Sandy-Smith serves as a technical liaison between Indium Corporation’s customers and internal departments, such as research and development and production, to ensure the best quality and selection of products. She earned two degrees from the international engineering program at the University of Rhode Island: one in chemical engineering with a focus on materials, the other in German language.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더, 프리폼 및 플럭스, 브레이즈, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
인디엄 코퍼레이션에 대한 자세한 내용은 www.indium.com 또는 이메일 ([email protected])로 문의하세요.
