Several Indium Corporation technology experts will present at the Surface Mount Technology Association’s International Conference and Exhibition (SMTAi) on October 15-17 in Fort Worth, Texas.
Dr. Ning-Cheng Lee, Vice President of Technology, will give three presentations.
Voiding and Reliability of BGA Assemblies with SAC and 57Bi42Sn1Ag Alloys explores replacing SAC solders with BiSnAg as a low-cost solution. The joint mechanical strength, drop test performance, and voiding performance of these alloys were evaluated against their reflow profile.
Corrosion Resistance of High Melting Lead-free BiAgX Solder Joints compares the corrosion resistance of Pb5/Sn2.5/Ag and SAC305 with BiAgX®, a drop-in lead-free solder paste solution for high temperature die-attach applications.
The Second Generation Shock Resistance and Thermally Reliable Low Ag SAC Solder Doped with Mn discusses the considerable improvement in shock resistance and thermal fatigue performance of a new soldering alloy doped with Mn.
Tim Jensen, Product Manager of PCB Assembly Materials, will present Alloy and Process Optimization for Low-Ag Solders. This presentation reviews the differences and impact of alternative alloys to SAC305 on electronics assembly.
Jensen will also give a workshop titled Soldering Technology for SMT: Achieving High Yields and Reliability. This workshop provides a detailed discussion of solder materials, components, and PCBs, and how each is important when producing a complete electronics product that meets current and future legislative restrictions. He will also include a detailed discussion of process optimization and defect elimination in the assembly process.
Dr. Ron Lasky, Senior Technologist, will present Using Weibull Analysis to Interpret Failure Data in Electronics Assembly Stress Testing. This presentation explores how to use the Weibull function to analyze failure data in electronics assembly. Lasky will discuss several case studies that include multiple failure modes and early first fails.
Brook Sandy-Smith, Product Support Specialist – PCB Assembly Materials, will present four papers:
Optimizing Assembly of QFNs explores several tested and proven strategies to minimize voiding in QFN assemblies, including thermal pad design and patterning, via placement, and addition of a flux-coated solder preform.
Measuring Tiny Solder Deposits with Accuracy and Repeatability discusses advancements in paste deposit inspection equipment, allowing for more accurate characterization of tiny solder deposits. This is especially important to ensure repeatability of miniaturized assemblies.
Probe Technologies to Improve First Pass Yield looks at the impact that flux residue permeability has on the first-pass yield results. It also discusses the role that aperture design has on creating an optimal surface for contact.
Productivity and Profitability Assessment of Improved Pin Probe Testing uses a case study to compare solder pastes with different flux residue characteristics and first-pass yields for in-circuit tests. Sandy-Smith also discusses factors that impact profitability, such as probe cleanliness, the number of actuations required to ensure repeatable testing, and false positives.
Additionally, Indium Corporation technical experts will be chairing several sessions.
Lee 博士是世界知名的焊接專家，也是 SMTA 的優秀會員。他在高溫聚合物、微電子封裝材料、底部填充物和粘合劑的開發方面擁有豐富的經驗。他目前的研究興趣包括用於電子和光電應用的互連和封裝的先進材料，強調高性能和低擁有成本。
詹森（Jensen）是一位獲得 SMTA 認證的製程工程師。他畢業於克拉克森大學（Clarkson University），取得化學工程學士學位。過去 15 多年來，他一直與客戶合作，針對 SMT 製程線進行故障排除與優化，並解決諸如「頭枕效應」（head-in-pillow）、元件纏結（graping）以及 QFN 空洞（voiding）等問題。 透過直接參與數百條 SMT 生產線的實務工作，他深諳每位客戶的獨特需求，並樂於透過撰寫技術論文及為技術刊物供稿來分享其專業知識。此外，他也積極參與多個 IPC 標準制定委員會的工作。
拉斯基博士曾榮獲極具聲望的 SMTA 創始人獎，是世界知名的製程專家，現任達特茅斯學院教學教授。他在電子與光電封裝及組裝領域擁有超過 25 年的經驗。他已撰寫或編輯五本專書及眾多技術論文，並持有數項專利公開。 拉斯基博士還經營一個技術部落格，網址為indiumstg.wpenginepowered.com/drlasky。
Sandy-Smith serves as a technical liaison between Indium Corporation’s customers and internal departments, such as research and development and production, to ensure the best quality and selection of products. She earned two degrees from the international engineering program at the University of Rhode Island: one in chemical engineering with a focus on materials, the other in German language.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料、預成型品和助熔劑；銅钎；濺鍍靶材；铟、鎵和锗金屬和無機化合物；以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠位於中國、新加坡、南韓、英國和美國。
如需進一步了解 Indium Corporation，請造訪indiumstg.wpenginepowered.com或發送電子郵件至[email protected]。
