Several Indium Corporation technology experts will present at the Surface Mount Technology Association’s International Conference and Exhibition (SMTAi) on October 15-17 in Fort Worth, Texas.
Dr. Ning-Cheng Lee, Vice President of Technology, will give three presentations.
Voiding and Reliability of BGA Assemblies with SAC and 57Bi42Sn1Ag Alloys explores replacing SAC solders with BiSnAg as a low-cost solution. The joint mechanical strength, drop test performance, and voiding performance of these alloys were evaluated against their reflow profile.
Corrosion Resistance of High Melting Lead-free BiAgX Solder Joints compares the corrosion resistance of Pb5/Sn2.5/Ag and SAC305 with BiAgX®, a drop-in lead-free solder paste solution for high temperature die-attach applications.
The Second Generation Shock Resistance and Thermally Reliable Low Ag SAC Solder Doped with Mn discusses the considerable improvement in shock resistance and thermal fatigue performance of a new soldering alloy doped with Mn.
Tim Jensen, Product Manager of PCB Assembly Materials, will present Alloy and Process Optimization for Low-Ag Solders. This presentation reviews the differences and impact of alternative alloys to SAC305 on electronics assembly.
Jensen will also give a workshop titled Soldering Technology for SMT: Achieving High Yields and Reliability. This workshop provides a detailed discussion of solder materials, components, and PCBs, and how each is important when producing a complete electronics product that meets current and future legislative restrictions. He will also include a detailed discussion of process optimization and defect elimination in the assembly process.
Dr. Ron Lasky, Senior Technologist, will present Using Weibull Analysis to Interpret Failure Data in Electronics Assembly Stress Testing. This presentation explores how to use the Weibull function to analyze failure data in electronics assembly. Lasky will discuss several case studies that include multiple failure modes and early first fails.
Brook Sandy-Smith, Product Support Specialist – PCB Assembly Materials, will present four papers:
Optimizing Assembly of QFNs explores several tested and proven strategies to minimize voiding in QFN assemblies, including thermal pad design and patterning, via placement, and addition of a flux-coated solder preform.
Measuring Tiny Solder Deposits with Accuracy and Repeatability discusses advancements in paste deposit inspection equipment, allowing for more accurate characterization of tiny solder deposits. This is especially important to ensure repeatability of miniaturized assemblies.
Probe Technologies to Improve First Pass Yield looks at the impact that flux residue permeability has on the first-pass yield results. It also discusses the role that aperture design has on creating an optimal surface for contact.
Productivity and Profitability Assessment of Improved Pin Probe Testing uses a case study to compare solder pastes with different flux residue characteristics and first-pass yields for in-circuit tests. Sandy-Smith also discusses factors that impact profitability, such as probe cleanliness, the number of actuations required to ensure repeatable testing, and false positives.
Additionally, Indium Corporation technical experts will be chairing several sessions.
Lee 博士是世界知名的焊接专家和 SMTA 杰出会员。他在高温聚合物、微电子封装材料、填充物和粘合剂的开发方面拥有丰富的经验。他目前的研究兴趣包括用于电子和光电应用互连和封装的先进材料，重点是高性能和低拥有成本。
Jensen is an SMTA-certified process engineer. He earned his bachelor’s degree in chemical engineering from Clarkson University. He has spent over 15 years working with customers to troubleshoot and optimize SMT process lines, and solving issues such as head-in-pillow, graping, and QFN voiding. Through his direct work on hundreds of SMT lines, he understands each customer’s unique requirements and readily shares his expertise by authoring technical papers and writing for technical publications. He also participates actively in several IPC standards development committees.
Dr. Lasky, holder of the prestigious SMTA Founder’s Award, is a world-renown process expert and an Instructional Professor at Dartmouth College. He has over 25 years of experience in electronics and optoelectronic packaging and assembly. He has authored or edited five books and numerous technical papers and holds several patent disclosures. Dr. Lasky also authors a technology blog, which can be found at www.indium.com/drlasky.
Sandy-Smith serves as a technical liaison between Indium Corporation’s customers and internal departments, such as research and development and production, to ensure the best quality and selection of products. She earned two degrees from the international engineering program at the University of Rhode Island: one in chemical engineering with a focus on materials, the other in German language.
Indium Corporation 是全球电子、半导体、太阳能、薄膜和热管理市场的主要材料制造商和供应商。产品包括焊料、预型件和助焊剂；钎料；溅射靶材；铟、镓和锗金属及无机化合物；以及 NanoFoil®。Indium 公司成立于 1934 年，在中国、新加坡、韩国、英国和美国拥有全球性的技术支持和工厂。
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