Indium Corporation's Global Product Manager, Semiconductor and Advanced Assembly Materials, Dr. Andy Mackie, will be presenting at the Surface Mount Technology Association (SMTA) Intermountain Expo and Technical Forum, March 22, 2011 at Boise State University, Boise, ID.
Dr. Mackie's presentation, "Theoretical and Practical Considerations for Optimizing PoP Assembly", will discuss both theoretical and practical considerations of the materials and processes used in package-on-package (PoP), and give assembly engineers tools for optimization.
Dr. Mackie has over 20 years of experience in new product and process development, and materials marketing in all areas of electronics manufacturing, including wafer fabrication, electronics assembly, and semiconductor packaging. He is an electronics industry expert in physical chemistry, surface chemistry, rheology, solder materials properties and processes (including solder paste printing), and reflow processes.
Dr. Mackie received the prestigious IPC President's Award in 2001 for his leadership in both the Solder Paste Task Group and the Assembly and Joining Materials sub-committee. He is formally trained in Six Sigma "Design of Experiments" and has written papers and lectured internationally on subjects ranging from sub-ppb metals analysis in supercritical carbon dioxide to pin-probe testing of flux residues. Additionally, Dr. Mackie holds patents in novel polymers, gas analysis, and solder paste formulation.
Dr. Mackie has a PhD in Physical Chemistry from the University of Nottingham, UK, and a Masters of Science (MSc) in Surface and Colloid Chemistry from the University of Bristol, UK. Dr. Mackie is based at Indium's global headquarters in Clinton, NY, USA. He is also the author of the Semiconductor / Power Semiconductor Assembly blog.
Indium Corporation will also be exhibiting at the event.
For more information or to register for the conference, visit the SMTA website.
Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.