3月24日（星期一），我将在内华达州拉斯维加斯举行的IPC APEX博览会上开设一门专业发展课程。
本课程《 理解并解决枕状缺陷、非湿润开路及QFN/CSP空焊挑战》将深入解析导致三类最棘手无铅组装缺陷的诸多因素，同时探讨如何优化工艺与材料以降低这些问题的发生概率。课程最后将全面剖析引发这些缺陷的机制，并阐明其在当今比过去更为普遍的原因。
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蒂姆
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