任何从事 BGA 焊点可靠性工作的人都应该熟悉 X 射线检测，Si-Li、Ge-Li 以及 Cd-Te 和 Cd-Zn-Te 使 X 射线检测成为可能。这些材料能感应 X 射线并将其转换为电信号。 X 射线设备非常适合对 BGA 焊点中的空隙、某些热界面、电源芯片附件以及一系列不同的焊接相关应用进行分类。
如果您想分享您的 X 光故事，请发送至[email protected]。 可在博客上分享不公开的故事。
In Part 2, we outlined materials challenges that can impact robotic soldering performance. In Part 3, we shift to product solutions and emerging innovations—highlighting how cored wire performance
In Part 1, we covered how robotic soldering evolved, and why materials quality is a major driver of process stability and precision. In Part 2, we focus on common materials-related issues that can
Robotic soldering has evolved from a productivity upgrade into a precision requirement—especially as electronics become smaller, denser, and require shorter production cycles. In Part 1 of this
