Trade Shows

Technical Conference Participation

EPP Innovations Forum

October 28-30, 2020
Virtual Event
  • Future Solutions for Individual Electronics Production in Germany
    Presenter: Andreas Karch, Regional Technical Manager for Germany, Austria, and Switzerland
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LEAP Expo

November 3-5, 2020
Shenzhen, China
  • Low-Temperature Solder Innovation—Durafuse™ LT and the Low- to Mid-Temperature Space
    Presenter: Anson Yu, Technical Manager for Global Accounts in Asia
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