EPP Innovations Forum

October 28-30, 2020
Virtual Event

• Future Solutions for Individual Electronics Production in Germany
  Presenter: Andreas Karch, Regional Technical Manager for Germany, Austria, and Switzerland

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LEAP Expo

November 3-5, 2020
Shenzhen, China

• Low-Temperature Solder Innovation—Durafuse™ LT and the Low- to Mid-Temperature Space
  Presenter: Anson Yu, Technical Manager for Global Accounts in Asia

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China Semiconductor Packaging Test (CSPT) Technology & Marketing Conference

November 8-10, 2020
TianShui City, China

• Ultra-Low Residue Flux Application in RF Front-End Package
  Instructor: Leo Hu, Area Technical Manager

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IMAPS UK

November 25-26, 2020
Virtual Event

• Thermal Interface Materials
  Presenter: Graham Wilson, Senior Technical Engineer

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