Corporate Communications

Webinars

Indium Corporation’s InSIDER Series is a free webinar program designed to help you enjoy technical content from any location.
Ultrafine Solder Paste Dispensing for Heterogeneous Integration web logo
Ultrafine Solder Paste Dispensing for Heterogeneous Integration
January 26, 2021 @ 8PM New York
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Presenter: Kenneth Thum

Miniaturization has been, and continues to be, a challenge for the electronics industry. Assemblies are getting more complex and component spacing is steadily decreasing. With more dies and components packed into smaller footprints, the need for heterogeneous integration for advanced packaging is getting greater.

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Reflow 101 from a Solder Manufacturer’s Perspective – Session I web logo
Reflow 101 from a Solder Manufacturer’s Perspective – Session I
February 10, 2021 @ 9AM New York
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Presenter: Kim Flanagan, CSMTPE

Soldering defects in SMT can arise from three main areas: the design, the materials, and the process. Identifying the root cause and troubleshooting these defects can be timely and expensive.

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Reflow 101 from a Solder Manufacturer’s Perspective – Session II web logo
Reflow 101 from a Solder Manufacturer’s Perspective – Session II
February 16, 2021 @ 9AM New York
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Presenter: Kim Flanagan, CSMTPE

Soldering defects in SMT can arise from three main areas: the design, the materials, and the process. Identifying the root cause and troubleshooting these defects can be timely and expensive.

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