Cleaning No Cleans – Doesn’t Have to be a Dirty Job

There are very good reasons why the industry continues to use no-clean solder paste. However, there are also equally good reasons why a no-clean solder paste may still need additional cleaning. Learn easy-to-follow steps to determine when and how to clean without sacrificing product performance with the joint webinar hosted by Indium Corporation and Kyzen.

5G Connectivity: Challenges and Gold Solutions

As a successor to 4G, the 5G connectivity network is sure to not only transform technology as we know it, but also provide an entirely new mobile experience for every user. With the development of new technologies, new challenges are sure to follow. The high-speed and bandwidth needed within the 5G connectivity network result in two common issues facing companies that are producing this mobile technology: controlling thermal management of and maintaining strong solder joints in the hardware. In this webinar, Jenny Gallery will discuss the challenges and present solutions that can improve the thermal transfer of high-output lasers, as well as solving the weak joint issue on the gold-rich substrate of gallium nitride (GaN) dies.

5G Connectivity: Challenges and Gold Solutions

As a successor to 4G, the 5G connectivity network is sure to not only transform technology as we know it, but also provide an entirely new mobile experience for every user. With the development of new technologies, new challenges are sure to follow. The high-speed and bandwidth needed within the 5G connectivity network result in two common issues facing companies that are producing this mobile technology: controlling thermal management of and maintaining strong solder joints in the hardware. In this webinar, Jenny Gallery will discuss the challenges and present solutions that can improve the thermal transfer of high-output lasers, as well as solving the weak joint issue on the gold-rich substrate of gallium nitride (GaN) dies.

Ask the Intern: A Q&A Session with Indium Corporation’s Summer Interns

Indium Corporation’s summer internship program is not your average internship. And, to truly understand the unique experience, who better to ask than the interns themselves?

During this Ask the Intern webinar – presented by Marketing Communications Intern Joy Valencia, Indium Corporation’s 2020 summer interns will share their experiences of the whole internship process, from onboarding to everyday work life, as well as their advice for future applicants. The interns come from a variety of disciplines – engineering, marketing communications, human resources, product management, etc. – providing plenty of different perspectives. There will also be a time where viewers can submit their questions to be answered in real-time by the panelists. It will be an opportunity for the surrounding communities and curious students to become more acquainted with Indium Corporation’s summer internship program.

Innovations in Liquid Metal Thermal Interface Materials

Gallium-based liquid metal has been used as a thermal interface material (TIM) in niche applications for years. In Innovations in Liquid Metal Thermal Interface Materials, Presenter Miloš Lazić will examine the key challenges and material characteristics that have limited their more widespread adoption despite their high conductivity. He will also identify several material innovations that overcome, or minimize, some of those challenges.

Innovations in Liquid Metal Thermal Interface Materials

Gallium-based liquid metal has been used as a thermal interface material (TIM) in niche applications for years. In Innovations in Liquid Metal Thermal Interface Materials, Presenter Miloš Lazić will examine the key challenges and material characteristics that have limited their more widespread adoption despite their high conductivity. He will also identify several material innovations that overcome, or minimize, some of those challenges.

Solder Attributes & Impact on Increased Product Reliability Requirements of Electronic Assemblies

The reliability specifications for the product lifetime validation of electronic assemblies are increasing due to the changing requirements of duration of use (increased cycles) as well as increased service temperatures (125-200°C). This is especially true in high-reliability verticals such as automotive, RF, and industrial applications. This makes the choice of solder materials more critical, as the solder paste attributes have a direct impact on increased product service life reliability requirements. in "Solder Attributes & Impact on Increased Product Reliability Requirements of Electronic Assemblies," Andreas Karch will discuss the parameters that should be taken into consideration to calculate the service life using the Coffin-Manson model. He will also discuss innovative solder solutions to address the higher thermo-mechanical loads on solder joints due to the increased mission profiles and product lifetime validation requirements.

PCB and Component Warpage Defects: HiP/HoP and Non-Wet Opens – Causes and Solutions

Heating PCBs for soldering can cause the substrate and components to potentially warp. This can cause parts to expand and contract, leading to common soldering defects such as HiP/HoP and non-wet opens. High-temperature lead-free soldering made these problems worse. To help solve these issues, interest had grown for low-temperature solders for reflow and selective soldering. However, not all companies have the ability to change the alloys they use. Invited guest speaker, Bob Willis will provide practical insights for common and not so common soldering and assembly problems relating to warpage. Some of the solutions as well as “shop floor tricks” will also be illustrated.

Subjects covered in this webinar will include:

·         PCB substrate warpage

·         Component package warp

·         Connector lifting

·         QFP pin opens

·         Process simulation and inspection methods

·         BGA solder shorts and opens

·         Solder paste graping

·         Missing pins

PCB and Component Warpage Defects: HiP/HoP and Non-Wet Opens – Causes and Solutions

Heating PCBs for soldering can cause the substrate and components to potentially warp. This can cause parts to expand and contract, leading to common soldering defects such as HiP/HoP and non-wet opens. High-temperature lead-free soldering made these problems worse. To help solve these issues, interest had grown for low-temperature solders for reflow and selective soldering. However, not all companies have the ability to change the alloys they use. Invited guest speaker, Bob Willis will provide practical insights for common and not so common soldering and assembly problems relating to warpage. Some of the solutions as well as “shop floor tricks” will also be illustrated.

Subjects covered in this webinar will include:

·         PCB substrate warpage

·         Component package warp

·         Connector lifting

·         QFP pin opens

·         Process simulation and inspection methods

·         BGA solder shorts and opens

·         Solder paste graping

·         Missing pins

Entendiendo y solucionando el defecto de voids en componentes BTCs (QFNs)

Los BTCs (Bottom Terminated Components) son componentes cada vez más comunes en la industria electrónica actual y con tendencia a incrementarse debido a su tamaño pequeño, excelente desempeño eléctrico y su habilidad de transferir el calor fuera del circuito integrado (IC).

En esta presentación, Entendiendo y solucionando el defecto de voids en componentes BTCs (QFNs), Ivan Castellanos discutirá, como se forman los voids en QFNs y como minimizarlos. También se revisaran otros factores que afectan a los voids, como el diseño del estencil, el grosor (thickness) del estencil, perfil de reflujo, mesh y tipo de polvo de la soldadura y desde luego el tipo de soldadura. Así mismo, se revisara la utilización de preformas de soldadura para minimizar los voids.

DFx on High Density Assemblies

Implementing high-density assembly in all electronic products requires a lot of considerations. Before starting any development work or implementing a new technology, it is critical to understand the product and industry requirements and capabilities; if this is not fully understood, failure is the most probable outcome.

There are many ways to increase the packaging density. However, the use of new technologies poses a number of challenges for solder paste selection, PCB design, assembly process and reliability, and the type end-product will have different challenges, concerns, and requirements in all aspects. The assembly line for many of these end-products will look very similar, but specification limits would be different. And when it comes to material section – and solder paste in particular – the type of end-product plays a big role.

Even with the right solder paste selection, a good assembly process and a quality PCB can still result in component failure, leading to yield losses and extra cost. In this webinar, we will discuss selection of the correct solder paste based on end-product and the need for doing proper root cause analysis before making any material or processes changes.