Corporate Communications

Webinars

Indium Corporation’s InSIDER Series is a free webinar program designed to help you enjoy technical content from any location.
Cleaning No Cleans – Doesn’t Have to be a Dirty Job web logo
Cleaning No Cleans – Doesn’t Have to be a Dirty Job
August 5, 2020 @ 5:30 AM EDT
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Presenter: Brian O’Leary of Indium Corporation, Debbie Carboni of Kyzen

There are very good reasons why the industry continues to use no-clean solder paste. However, there are also equally good reasons why a no-clean solder paste may still need additional cleaning. 

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5G Connectivity: Challenges and Gold Solutions web logo
5G Connectivity: Challenges and Gold Solutions
August 5, 2020 @ 8:00 AM EDT
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Presenter: Jenny Gallery

As a successor to 4G, the 5G connectivity network is sure to not only transform technology as we know it, but also provide an entirely new mobile experience for every user. 

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5G Connectivity: Challenges and Gold Solutions web logo
5G Connectivity: Challenges and Gold Solutions
August 5, 2020 @ 2:00 PM EDT
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Presenter: Jenny Gallery

As a successor to 4G, the 5G connectivity network is sure to not only transform technology as we know it, but also provide an entirely new mobile experience for every user. 

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Ask the Intern: A Q&A Session with Indium Corporation’s Summer Interns web logo
Ask the Intern: A Q&A Session with Indium Corporation’s Summer Interns
August 6, 2020 @ 11:00 AM New Yor
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Presenter: Joy Valencia

Indium Corporation’s summer internship program is not your average internship. And, to truly understand the unique experience, who better to ask than the interns themselves?

 

 

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Innovations in Liquid Metal Thermal Interface Materials web logo
Innovations in Liquid Metal Thermal Interface Materials
August 27, 2020 @ 8:00 AM EST
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Presenter: Miloš Lazić

Gallium-based liquid metal has been used as a thermal interface material (TIM) in niche applications for years. 

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Innovations in Liquid Metal Thermal Interface Materials web logo
Innovations in Liquid Metal Thermal Interface Materials
August 27, 2020 @ 3:00 PM EST
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Presenter: Miloš Lazić

Gallium-based liquid metal has been used as a thermal interface material (TIM) in niche applications for years. 

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Solder Attributes & Impact on Increased Product Reliability Requirements of Electronic Assemblies web logo
Solder Attributes & Impact on Increased Product Reliability Requirements of Electronic Assemblies
September 2, 2020 @ 9:00 AM EST
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Presenter: Andreas Karch

The reliability specifications for the product lifetime validation of electronic assemblies are increasing due to the changing requirements of duration of use (increased cycles) as well as increased service temperatures (125-200°C). 

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PCB and Component Warpage Defects: HiP/HoP and Non-Wet Opens – Causes and Solutions web logo
PCB and Component Warpage Defects: HiP/HoP and Non-Wet Opens – Causes and Solutions
September 9, 2020 @ 5:30 AM EDT
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Presenter: Bob Willis

Heating PCBs for soldering can cause the substrate and components to potentially warp. This can cause parts to expand and contract, leading to common soldering defects such as HiP/HoP and non-wet opens.

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PCB and Component Warpage Defects: HiP/HoP and Non-Wet Opens – Causes and Solutions web logo
PCB and Component Warpage Defects: HiP/HoP and Non-Wet Opens – Causes and Solutions
September 9, 2020 @ 12:00 PM EDT
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Presenter: Bob Willis

Heating PCBs for soldering can cause the substrate and components to potentially warp. This can cause parts to expand and contract, leading to common soldering defects such as HiP/HoP and non-wet opens.

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Entendiendo y solucionando el defecto de voids en componentes BTCs (QFNs) web logo
Entendiendo y solucionando el defecto de voids en componentes BTCs (QFNs)
September 22, 2020 @ 1:00 PM New York
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Presenter: Ivan Castellanos

Los BTCs (Bottom Terminated Components) son componentes cada vez más comunes en la industria electrónica actual y con tendencia a incrementarse debido a su tamaño pequeño, excelente desempeño eléctrico y su habilidad de transferir el calor fuera del circuito integrado (IC).

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DFx on High Density Assemblies web logo
DFx on High Density Assemblies
October 13, 2020 @ 8AM New York
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Presenter: Jonas Sjoberg

Implementing high-density assembly in all electronic products requires a lot of considerations. Before starting any development work or implementing a new technology, it is critical to understand the product and industry requirements and capabilities; if this is not fully understood, failure is the most probable outcome.

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View our library of past webinars