Webinars

Webinars

Indium Corporation’s InSIDER Series is a free webinar program designed to help you enjoy technical content from any location.

Upcoming Webinars

EPP Assembly Reliability Webinar web logo
EPP Assembly Reliability Webinar
June 9, 2020 @ 10:00 AM CET
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Presenter: Andreas Karch

Indium Corporation’s Andreas Karch, Regional Technical Manager, Germany, Austria, and Switzerland, will be featured in a German-language webinar with Elektronik, Produktion, und Prüftechnik (EPP)

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Voiding Workshop: Understand and troubleshoot voiding in bottom terminated components (BTCs) web logo
Voiding Workshop: Understand and troubleshoot voiding in bottom terminated components (BTCs)
June 11, 2020 @ 9:00 AM EST
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Presenter: Dr. Ron Lasky

Bottom terminated components (BTCs) are one of the most common packages in electronics today with the highest growth rate due to their small size, excellent electrical performance, and ability to transfer heat away from the integrated circuit (IC). Read more

Voiding Workshop: Understand and troubleshoot voiding in bottom terminated components (BTCs) web logo
Voiding Workshop: Understand and troubleshoot voiding in bottom terminated components (BTCs)
June 11, 2020 @ 2:00 PM EST
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Presenter: Dr. Ron Lasky

Bottom terminated components (BTCs) are one of the most common packages in electronics today with the highest growth rate due to their small size, excellent electrical performance, and ability to transfer heat away from the integrated circuit (IC). Read more

What's Driving: Automotive Electronics Assembly and Packaging web logo
What's Driving: Automotive Electronics Assembly and Packaging
July 28, 2020 @ 8:00 AM EST
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Presenter: Andy Mackie, PhD, MSc

The evolution of the automobile over the past decade has been faster than ever before, and the 2020s promise even more rapid progress. The changes we will all experience include the nature of car ownership, how the car is powered, increased safety, and driver automation.

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What's Driving: Automotive Electronics Assembly and Packaging  web logo
What's Driving: Automotive Electronics Assembly and Packaging
July 28, 2020 @ 2:30 PM EST
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Presenter: Andy Mackie, PhD, MSc

The evolution of the automobile over the past decade has been faster than ever before, and the 2020s promise even more rapid progress. The changes we will all experience include the nature of car ownership, how the car is powered, increased safety, and driver automation.

Read more


Webinar Archive Library

Global SMT & Packaging debate on low-temperature solders  web logo
Global SMT & Packaging debate on low-temperature solders
June 2, 2020
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Presenter: Chris Nash

The debate will focus on the development of low-temperature solders for specific applications, and how increased reliability and reduced stress on the board is making low-temperature solder an appealing product for a wider variety of applications.

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SMTA Wisconsin SMT Printing Webinar web logo
SMTA Wisconsin SMT Printing Webinar
June 2, 2020
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Presenter: Adam Murling

The SMTA webinar is designed to be an open discussion about SMT printing challenges in the industry and will start with a Printing 101 — the basics of SMT printing. Topics covered will include insufficient solders, excessing solders, high tension stencils, nano coating (life), paste size and pin-and-paste.

 

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Optimization of the Robotic Soldering Process: A Focus on Solder Spread and Spattering web logo
Optimization of the Robotic Soldering Process: A Focus on Solder Spread and Spattering
May 21, 2020
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Presenter: Robert McKerrow

Adoption of robotic soldering is growing within the PCB Assembly industry. This method is more efficient than hand soldering, so it aids in alleviating human mistakes.  View Now

Low-Temperature Solder Innovation — Durafuse™ LT and the Low to Mid-Temperature Space  web logo
Low-Temperature Solder Innovation — Durafuse™ LT and the Low to Mid-Temperature Space
May 13, 2020
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Presenter: Claire Hotvedt

Low temperature soldering is not a one alloy fits all situation. The actual temperature required for “low temperature” applications can vary widely. View Now

DPAK Voiding: A Study to Determine the Origins of DPAK Voiding web logo
DPAK Voiding: A Study to Determine the Origins of DPAK Voiding
April 28, 2020
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Presenter: Kim Flanagan

Indium Corporation’s Kim Flanagan, Technical Support Engineer, Senior Product Manager for Engineered Solder Materials, will host a webinar on liquid metal thermal interface materials. View Now