Ultrafine Solder Paste Dispensing for Heterogeneous Integration
January 26, 2021 @ 8PM New York
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Presenter: Kenneth Thum
Miniaturization has been, and continues to be, a challenge for the electronics industry. Assemblies are getting more complex and component spacing is steadily decreasing. With more dies and components packed into smaller footprints, the need for heterogeneous integration for advanced packaging is getting greater.
Read moreUltrafine Solder Paste Dispensing for Heterogeneous Integration
Miniaturization has been, and continues to be, a challenge for the electronics industry. Assemblies are getting more complex and component spacing is steadily decreasing. With more dies and components packed into smaller footprints, the need for heterogeneous integration for advanced packaging is getting greater. However, solder paste printing is not always possible in some packaging designs and solder paste dispensing can be an alternative method for solder paste deposition. Ultrafine solder paste dispensing is only achievable with the correct combination of dispensing equipment and solder materials. In Ultrafine Solder Paste Dispensing for Heterogeneous Integration, presenter Kenneth Thum will discuss different dispensing equipment technologies and important solder paste characteristics, along with sharing a solution for and steps on how to achieve consistent fine-dot dispensing.
