Corporate Communications

Webinars

Indium Corporation’s InSIDER Series is a free webinar program designed to help you enjoy technical content from any location.
Global SMT & Packaging Debate web logo
Global SMT & Packaging Debate
October 6, 2020 @ 10:45 AM NY Time
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Presenter: David Sbiroli

David Sbiroli, R&D Senior Technologist, will participate in a Global SMT & Packaging debate on advanced print and paste deposition techniques.

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Achieving High-Reliability of Solder Joints web logo
Achieving High-Reliability of Solder Joints
October 12, 2020
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Presenter: Dr. Ning-Cheng Lee

Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will be one of five workshop trainers at Electronic Packaging Convention Asia 2020 (EPCON Asia), Oct. 6-8 and 12-14.

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DFx on High Density Assemblies web logo
DFx on High Density Assemblies
October 13, 2020 @ 8AM New York
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Presenter: Jonas Sjoberg

Implementing high-density assembly in all electronic products requires a lot of considerations. Before starting any development work or implementing a new technology, it is critical to understand the product and industry requirements and capabilities; if this is not fully understood, failure is the most probable outcome.

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Choosing Solders for the New Era web logo
Choosing Solders for the New Era
October 13, 2020
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Presenter: Dr. Ning-Cheng Lee

Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will be one of five workshop trainers at Electronic Packaging Convention Asia 2020 (EPCON Asia), Oct. 6-8 and 12-14.

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DFx for Advanced Soldering Technology web logo
DFx for Advanced Soldering Technology
October 14, 2020
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Presenter: Dr. Ning-Cheng Lee

Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will be one of five workshop trainers at Electronic Packaging Convention Asia 2020 (EPCON Asia), Oct. 6-8 and 12-14.

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Versatile TIM Solution with Chain Network Solder Composite web logo
Versatile TIM Solution with Chain Network Solder Composite
October 22, 2020 @ 15:40 PM Taiwan
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Presenter: Dr. Ning-Cheng Lee

Indium Corporation expert Dr. Ning-Cheng Lee, Vice President of Technology, will present technical content during IMPACT-EMAP 2020, Oct. 21-23. 

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5G Base Station Introduction: Soldering Challenges and Solutions web logo
5G Base Station Introduction: Soldering Challenges and Solutions
November 10, 2020 @ 7PM New York
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Presenter: Foo Siang Hooi

5G networks began rolling out in 2018. Although the technology is still in its early stages, it is expected that the networks will become faster and connect even more devices than now. The networks are powered by 5G base stations which include active antenna units (AAU), antennas, remote radio units (RRU), and base band units (BBU).

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Soldering Material Evolution for Heterogeneous Integration Assembly web logo
Soldering Material Evolution for Heterogeneous Integration Assembly
November 11, 2020 @ 7:30PM New York
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Presenter: Sze Pei Lim

The development of heterogeneous integration, which packs more dies or components into a smaller footprint, requires multiple technological advancements in various aspects of advanced packaging, such as substrate design, interconnect methods, and materials.

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View our library of past webinars