DFx on High Density Assemblies
Implementing high-density assembly in all electronic products requires a lot of considerations. Before starting any development work or implementing a new technology, it is critical to understand the product and industry requirements and capabilities; if this is not fully understood, failure is the most probable outcome.
There are many ways to increase the packaging density. However, the use of new technologies poses a number of challenges for solder paste selection, PCB design, assembly process and reliability, and the type end-product will have different challenges, concerns, and requirements in all aspects. The assembly line for many of these end-products will look very similar, but specification limits would be different. And when it comes to material section – and solder paste in particular – the type of end-product plays a big role.
Even with the right solder paste selection, a good assembly process and a quality PCB can still result in component failure, leading to yield losses and extra cost. In this webinar, we will discuss selection of the correct solder paste based on end-product and the need for doing proper root cause analysis before making any material or processes changes.